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Improving SINR with smart RIS solutions: exploring optimal dimensions and sizes

Published online by Cambridge University Press:  17 February 2025

Bushra J. Qeryaqos  and
Saad A. Ayoob Open the ORCID record for Saad A. Ayoob [Opens in a new window]
Bushra J. Qeryaqos
Affiliation:
Department of Electrical Engineering, University of Mosul, College of Engineering, Mosul, Iraq
Saad A. Ayoob*
Affiliation:
Department of Electrical Engineering, University of Mosul, College of Engineering, Mosul, Iraq
*
Corresponding author: Saad A. Ayoob; Email: [email protected]
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Abstract

Reconfigurable intelligent surfaces (RISs) enhance the performance of wireless communication networks, particularly within millimeter wave (mm-Wave) bands. When a line-of-sight link is not strong enough or is fully blocked. The location of RIS has a significant impact on the RIS’s wireless channel and system performance. A wireless communication model has been proposed in a mm-Wave environment supported by RIS. The proposed model contains one transmitter and five users at the receiving end. Due to the small distance between users, there is interference between them and the received signal-to-interference-plus-noise ratio (SINR) decreases. Three RISs separated by different interspace distances were proposed to serve users at various distances from the transmitter to reduce inter-user interference. The simulation results showed that increasing the distance between the RIS site and the TX-User line served a larger number of users, and the three heights of the RIS provided a coverage range domain complementary to each other for different user sites. The improvement percentages in SINR for the second and third RIS are 48.46% and 77.38%, respectively. Enlarging the size of the RIS only increases the signal capacity and does not affect the coverage range domain of the single RIS.

Keywords

6Gmm-WaveNLOSRISSINR
Type
Research Paper
Information
International Journal of Microwave and Wireless Technologies , First View , pp. 1 - 10
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Copyright
© The Author(s), 2025. Published by Cambridge University Press in association with The European Microwave Association.

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