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GaN devices for communication applications: evolution of amplifier architectures

Published online by Cambridge University Press:  19 April 2010

Ulf Schmid*
Affiliation:
EADS – T/R Modules and MMICs, Woerthstrasse 85, 89077 Ulm, Germany.
Rolf Reber
Affiliation:
EADS – T/R Modules and MMICs, Woerthstrasse 85, 89077 Ulm, Germany.
Sébastien Chartier
Affiliation:
EADS – T/R Modules and MMICs, Woerthstrasse 85, 89077 Ulm, Germany.
Kristina Widmer
Affiliation:
EADS – T/R Modules and MMICs, Woerthstrasse 85, 89077 Ulm, Germany.
Martin Oppermann
Affiliation:
EADS – T/R Modules and MMICs, Woerthstrasse 85, 89077 Ulm, Germany.
Wolfgang Heinrich
Affiliation:
Ferdinand-Braun-Institut (FBH), Gustav-Kirchhoff-Straße 4, 12489 Berlin, Germany.
Chafik Meliani
Affiliation:
Ferdinand-Braun-Institut (FBH), Gustav-Kirchhoff-Straße 4, 12489 Berlin, Germany.
Rüdiger Quay
Affiliation:
Fraunhofer Institute Applied Solid-State Physics (FhG-IAF), Tullastrasse 72, D-79108 Freiburg, Germany.
Stephan Maroldt
Affiliation:
Fraunhofer Institute Applied Solid-State Physics (FhG-IAF), Tullastrasse 72, D-79108 Freiburg, Germany.
*
Corresponding author: U. Schmid Email: [email protected]

Abstract

This paper presents the design and implementation of power amplifiers using high-power gallium nitride (GaN) high electronic mobility transistor (HEMT) powerbars and monolithic microwave integrated circuits (MMICs). The first amplifier is a class AB implementation for worldwide interoperability for microwave access (WiMAX) applications with emphasis on a low temperature cofired ceramics (LTCC) packaging solution. The second amplifier is a class S power amplifier using a high power GaN HEMT MMIC. For a 450 MHz continuous wave (CW) signal, the measured output power is 5.8 W and drain efficiency is 18.5%. Based on time domain simulations, loss mechanisms are identified and optimization steps are discussed.

Type
Original Article
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2010

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References

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