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7 - Growth, Upgrading, and Limited Catch-Up in China’s Semiconductor Industry
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- Book:
- Policy, Regulation and Innovation in China's Electricity and Telecom Industries
- Published online:
- 08 June 2019
- Print publication:
- 30 May 2019, pp 262-303
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Mitigating Curtaining Artifacts During Ga FIB TEM Lamella Preparation of a 14 nm FinFET Device
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- Journal:
- Microscopy and Microanalysis / Volume 23 / Issue 3 / June 2017
- Published online by Cambridge University Press:
- 20 March 2017, pp. 484-490
- Print publication:
- June 2017
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- Article
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Three-Dimensional Measurement of Line Edge Roughness in Copper Wires Using Electron Tomography
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- Journal:
- Microscopy and Microanalysis / Volume 15 / Issue 3 / June 2009
- Published online by Cambridge University Press:
- 22 May 2009, pp. 244-250
- Print publication:
- June 2009
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