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Mitigating Curtaining Artifacts During Ga FIB TEM Lamella Preparation of a 14 nm FinFET Device
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- Journal:
- Microscopy and Microanalysis / Volume 23 / Issue 3 / June 2017
- Published online by Cambridge University Press:
- 20 March 2017, pp. 484-490
- Print publication:
- June 2017
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- Article
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