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Effect of Zn content on interfacial reactions of Ni/Sn–xZn/Ni joints under temperature gradient

Published online by Cambridge University Press:  29 August 2017

Ning Zhao ,
Jianfeng Deng ,
Yi Zhong ,
Haitao Ma ,
Yunpeng Wang  and
Ching-ping Wong
Ning Zhao*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Jianfeng Deng
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Yi Zhong
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Haitao Ma*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Yunpeng Wang
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, People’s Republic of China
Ching-ping Wong
Affiliation:
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA
*
a) Address all correspondence to these authors. e-mail: [email protected]
b) e-mail: [email protected]
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Abstract

Ni/Sn–xZn/Ni (x = 1, 5, 9 wt%) joints were used to investigate the effect of Zn content on interfacial reactions during reflow under a temperature gradient. Asymmetrical growth and transformation of intermetallic compounds (IMCs) occurred between the cold and hot end interfaces. Faster IMC growth at the cold end and a more prompt IMC transformation at the hot end in a lower Zn content solder joint were identified due to the more thermomigration-induced Zn and Ni atomic fluxes toward the cold end. The main diffusion species into IMC layers changed from Zn atoms at the early stage to Sn and Ni atoms at the later stage. As a result, the IMC evolution followed (Ni,Zn)3Sn4 → Ni3Sn4 in the Ni/Sn–1Zn/Ni joint, Ni5Zn21 → τ phase → Ni3Sn4 in the Ni/Sn–5Zn/Ni joint, and Ni5Zn21 → τ phase in the Ni/Sn–9Zn/Ni joint along with the reflow time. A higher Zn content could effectively inhibit the dissolution of the hot-end Ni substrate and restrain the growth rate of the cold-end interfacial IMCs.

Keywords

electronic materialpackagingsoldering
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 18 , 28 September 2017 , pp. 3555 - 3563
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Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Jürgen Eckert

A previous error in this article has been corrected, please see doi: 10.1557/jmr.2017.379.

References

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