We present low-temperature (T = 4K) photoluminescence studies of the effect of adding nitrogen to 6-nm-wide single-strained GaAsSb quantum wells on GaAs. The samples were grown by both MBE and MOCVD tech-niques. The nominal Sb concentration is about 30%. Adding about 1 to 2% N drastically reduced the bandgap energies from 1 to 0.75 eV, or 1.20 to 1.64 μm. Upon performing ex situ rapid thermal anneals, 825°C for 10s, the band gap energies as well as the photoluminescence intensities increased. The intensities increased by an order of magnitude for the annealed samples and the band gap energies increased by about 50 - 100 meV, depending on growth temperatures. The photoluminescence linewidths tended to decrease upon annealing. Preliminary results of a first-principles band structure calculation for the GaAsSbN system are also presented.

We have investigated, theoretically and experimentally, the reduced and optical bandgap shift of Si-doped AlXGa1-XAs alloys as a function of both the Al composition and the Si concentration. The calculations were carried out within a framework of the many particle random phase approximation with the Hubbard local-field correction, considering electron populations in the conduction minima located at the Γ, X and L-points of the Brillouin zone. The experimental data have been obtained by means of photoluminescence spectroscopy. The theoretical predictions are found to be in good agreement with the experimental results.

The potential profile of InGaAs quantum dots (QDs) was shown to be easily modified with annealing. We also demonstrate the use of spin-on-glass to create interdiffusion in QDs but the degree of interdiffusion was strongly dependent on the properties of the oxide. By using TiO2 significant suppression of thermal diffusion of the quantum dots could be achieved. On the other hand, very large additional blue shifts (in excess of 120 meV) could be obtained with both H and As implantation. The different nature of defects created by both ions and how they affect the interdiffusion of quantum dots were illustrated. In the dose and annealing temperature range studied, the degree of interdiffusion ultimately depends on the availability of free point defects or point defects liberated from clusters/extended defects to diffuse across the quantum dots.

Optical absorption in the defect-related region of highly efficient non-linear ZnGeP2 crystals under e-beam irradiation and post-irradiation anneals has been investigated.

Partially irreversible changes of the absorption were found in the spectral range 0.9–2.5 μm (0.5–1.3 eV) after irradiation and subsequent low-temperature anneals. Data obtained do not support the vacancy model for ZnGeP2 absorption in the 0.5–1.3 eV range.

The least squares fit for the parameters of the theoretical dependence of optical absorption cross-section to the experimentally measured ZnGeP2 optical absorption coefficient spectra show that the defect-related absorption in 0.5–1.3 eV region is caused by deep donor levels with energy position E=Ev+(0.85–0.90) eV.

Significant changes in the energy spectrum of the dominant optically active centers have been observed under influence of e-beam irradiation and post-irradiation anneals.

Based on the optical absorption measurements obtained for as-grown, annealed and e-irradiated ZnGeP2 crystals, a model of point defect interactions has been proposed. This takes into account both the reversible interactions, such as the formation of donor-acceptor pairs, and the irreversible interactions of a quasi-chemical type.

The behavior of the energy spectrum of the optically active defects is discussed in terms of the modes of interaction between the initial point defects and those generated by irradiation. The analysis performed showed that the best agreement with experimental data is reached when it is assumed that optical defect-related absorption in the 0.5–1.3 eV range related mainly to the disordering defect in the cation sublattice of ZnGeP2, namely, to atoms of Ge substituting for Zn.

Defect concentration profiles created by e-irradiation in ZGP crystals of different thickness were calculated. The optimum conditions for providing a uniform defect distribution with depth in irradiated ZnGeP2 samples were determined.

The optimal e-beam irradiation fluences, giving maximum ZnGeP2 enlightenment, allowed us to reduce the defect-related absorption down to a value of 0.01 cm-1 at 2 μm.

Ion beam stimulated solid phase crystallization of a-Si1-xGex (0 ≤ x ≤ 1) on SiO2 has been investigated. The critical temperature to cause crystal nucleation can be successfully decreased by 150 °C for a-Si1-xGex with all Ge fractions (0 - 100 %) by using ion stimulation. As a result, crystal growth below the softening temperature (∼ 500 °C) of glass substrates was achieved for samples with Ge fractions exceeding 50 %. This method combined with Ge doping and ion stimulation will be a powerful tool to fabricate poly-SiGe TFTs on low cost glass substrates.

We report on intersubband transitions in InxGa1-xAs/AlGaAs multiple quantum wells (MQWs) grown by molecular beam epitaxy. The conduction band offset for this material system is larger than that of the well known GaAs/AlGaAs system, thus making it possible to design, grow, and fabricate quantum well infrared photodetectors operational beyond the 14 μm spectral region with minimized dark current. We have grown InxGa1-xAs/AlGaAs MQWs with indium compositions ranging from x = 0.08 to 0.20 verified by in situ RHEED oscillations, band offset measurements, and high-resolution X-ray diffraction. Band-to-band transitions were verified by photoluminescence measurements, and intersubband transitions were measured using Fourier transform infrared (FTIR) spectroscopy. Due to the high strain and introduction of dislocations associated with the high indium content, wells with indium compositions above ∼ 0.12 did not result in intersubband transitions at silicon doping levels of 2×1018 cm-3. A thick linear graded InxGa1-xAs buffer was grown below the MQW structures to reduce the strain and resulting dislocations. Intersubband transitions were measured in InxGa1-xAs wells with indium compositions of x = 0.20 and greater when grown on top of the linear graded buffer. In addition to these results, FTIR measurements on InGaAs/AlGaAs MQW multi-color, long-wavelength infrared detector structures are reported.

Amorphous/crystalline silicon (a-Si/c-Si) heterojunctions are of particular importance in photovoltaic (PV) energy conversion in a cost-effective way. This is principally due to the low temperature (low-T) nature of the process. In this work, we have analyzed a (n)a-Si/(i)a-Si/(p)c-Si heterojunction solar cell structure using theoretical models for internal quantum yield (IQY) and I-V behavior. We considered low-quality (low bulk lifetime), cheaper substrates. Thin, low bulk lifetime substrates in combination with a low-T bulk passivation scheme and low rear surface recombination can lead to a cost effective device fabrication process with competitive conversion efficiency.

Packaging of HgCdTe photodiode detector arrays in a dewar involves degassing at elevated temperatures for several days so as to achieve vacuum integrity. This sustained exposure to relatively high temperatures can influence the HgCdTe bulk material properties, p-n junction integrity, and the passivant-HgCdTe interface. This work investigates the effects of bake-out treatment on the performance of HgCdTe based photodiodes formed using a new plasma induced type conversion process. Experimental results of a series of experiments in both long-wavelength infrared (LWIR) and mid-wavelength infrared (MWIR) devices are presented.

Bulk lifetime was used as an indicator of the change in the bulk material resulting from baking in vacuum and was measured by photoconductive decay. These measurements did not show any appreciable changes as a result of baking. Modification of the doping profile in the n-p junction may also result from high temperature baking. Doping profiles of the photodiodes were studied by measuring the junction capacitance-voltage relation before and after baking. The results of these tests after baking showed no changes to C-V measurements from those before bake.

The effect of baking on the passivant/HgCdTe interface was also examined by carrying out surface recombination velocity measurements by photoconductive decay on samples with different passivation layers.

Variable area HgCdTe photodiodes have also been fabricated and studied to understand the effect of the surface condition of the performance of the devices. Initial bake tests on LWIR devices show that the technology is stable when employing a double layer passivation technique. Bake tests on the more advanced MWIR technology indicates that the plasma induced type conversion process produces stable photodiodes with state of the art performance.

Zinc oxide (ZnO) crystals grown by the seeded chemical vapor transport method have been studied using photoluminescence (PL), thermoluminescence (TL), and electron paramagnetic resonance (EPR) techniques. Lithium acceptors were diffused into the crystals during anneals in LiF powder at temperatures in the 750 to 850°C range. After a lithium diffusion, EPR was used to monitor neutral lithium acceptors and neutral shallow donors, as well as Ni3+, Fe3+, and Cu2+ impurities unintentionally present. Excitonic and deep-level PL emissions were also monitored before and after these diffusions. Two broad overlapping TL emission bands were observed at 117 and 145 K when a Li-diffused crystal was illuminated at 77 K with 325-nm light and then rapidly warmed to room temperature. The two TL bands have the same spectral dependence (the peak in wavelength is 540 nm when the intensity of the light reaches a maximum). These “glow” peaks occur when electrons are thermally released from Ni2+ and Fe2+ ions and recombine with holes at neutral lithium acceptors.

Optical waveguides are being explored for on-chip purposes to overcome the speed limitations of electrical interconnects. Passive optical components like waveguides and vertical outcouplers are important components in such schemes. In this study we fabricate planar waveguides with integrated vertical micro-mirrors using standard Back End of the Line silicon (BEOL) CMOS based processes. Around 1.6 μm of a hybrid alkoxy siloxane polymer with a refractive index of ∼ 1.50 at the intended wavelength of 830 nm is used as the core and plasma deposited silicon oxide with a refractive index of ∼ 1.46 is used as the cladding. The angular face in the polymer waveguide that would function as the mirror surface was fabricated by a pattern transfer method which involves transferring the angle in a template to the waveguide using anisotropic reactive ion etching. The sidewall angle realized in a positive resist on patterning was used as the angle template. Exposure and development conditions were adjusted for Shipley® S1813 photoresist to generate a sidewall angle of ∼ 65°. The anisotropic Reactive Ion Etching (RIE) was done using a CF4/O2 plasma chemistry. A gas composition of 50/50 CF4/O2 was chosen in order to minimize the etch related roughness of the polymer and the photoresist. The metallization of the mirror faces was done using a self-aligned maskless technique which ensures metal deposition only on the angular face and also eliminates a lithography step.

Epitaxial films of undoped ZnOxTe(1-x) have been prepared on double-side polished c-axis oriented sapphire substrates with pulsed laser deposition. The method of epitaxial growth is expected to have the same domain matching epitaxial relationship with sapphire as does pure ZnO, where six lattice planes of ZnOxTe(1-x) match with seven lattice planes of sapphire [1,2]. High quality, single crystal, epitaxial alloys with around 4% Te have been grown that demonstrate excellent optical properties and a pronounced, sharp excitonic peak, in optical transmission. The incorporation of Te makes the compound more covalent, and less ionic than pure ZnO. Transmission electron microscopy (TEM) demonstrates single-crystal growth with a sharp interface. The low-resolution X-ray diffraction (XRD) pattern of ZnOxTe(1-x) films is almost indistinguishable from those of pure ZnO, except a usually diminished intensity of the (0004) peak. The incorporation of Te in ZnO was verified by a shift in excitonic peak position in absorption, and through a shift in cathodoluminescence (CL) peak. X-ray photoelectron spectroscopy (XPS) data verifies incorporation of telluride chemical state of tellurium atoms. Rutherford backscattering/channeling (RBS/C) confirmed crystal quality for the pure ZnO films. Hot-point probe measurements indicate as-grown, undoped films to be somewhat higher in resistivity than pure ZnO with inconclusive carrier type, as compared to the naturally n-type ZnO. This may be a consequence of the more covalent bonding between Zn and Te and suggests a possible strategy for p-type doping.

First basic investigations on lanthanide implanted cubic boron nitride were performed with focus on the site of the implanted ions as well as their luminescence behaviour. In order to investigate the lattice sites of lanthanides in c-BN, we implanted single crystal c-BN with radioactive 139Ce ions using the on-line isotope separator ISOLDE at CERN. After the samples were annealed at 1193 K, direct lattice location studies were performed using the conversion electron emission channeling technique and showed a near-substitutional fraction of the implanted ions of at least 10 %. Additionally, poly crystalline c-BN samples were implanted with stable Eu and Tm ions in order to investigate the luminescence properties of triply ionised lanthanides in the c-BN host. It is found that the annealing of the implanted samples at high temperature and high pressure results in strong luminescence of the Eu3+ ions in the orange and moderate luminescence of the Tm3+ ions in the blue. In case of the Eu implanted samples, the luminescence is assigned to the 5D0-7FJ intra-4f electron transitions of Eu3+, in case of the Tm implanted samples, detectable transitions are 1D2-3H6, 1D2-3F4, 1G4-3H6. of Tm3+.

We show results for molecular beam epitaxial (MBE) growth of praseodymium oxide on Si. On Si(100) oriented surfaces, crystalline Pr2O3 grows as (110)-domains, with two orthogonal in-plane orientations. Epitaxial overgrowth with Si could not been realized so far. We obtain perfect epitaxial growth of hexagonal Pr2O3 on Si(111). These layers can also be overgrown epitaxially with Si leading to novel tunnel structures. Crystalline Pr2O3 on Si(OOl) is a promising candidate for highly scaled gate insulators, displaying sufficiently high-K value of around 30, ultra-low leakage current density, good reliability, and high electrical breakdown voltage. The Pr2O3/Si(001) interface exhibits the symmetric band alignment, desired for applying such material in both n- and p-type devices. The valence band as well as the conduction band offset to Si is above 1 eV. The electron masses can be assumed to be very heavy in the oxide. This effect together with the suitable band offsets leads to the unusually low leakage currents found experimentally. Finally, the integration of crystalline Pr2O3 high-K gate dielectrics into a conventional CMOS process will be demonstrated.

We studied the influence of n-metal alloy on the long wavelength InP device performance. Various alloy schemes of rapid thermal annealing (RTA) were experimented to obtain the optimized contact resistance for the n-InP/AuGe/Ni/Au/Cr/Au metallization systems. Significant resistance reduction was achieved at 390°C for 45sec with wafer flattening step at 310°C. Using scanning transmission electron microscopy (STEM) and Auger electron spectroscopy (AES) analyses, we showed that resistance was correlated with interfacial reaction at the n-InP/metal. For the high resistance devices, little interfacial reaction between n-InP and Au occurred. For the low resistance devices, significant out-diffusion of P in the bottom Au and Ni layers occurred, forming Au-P and Ni-P metallic compounds. In addition, accumulation of Ge in the Ni layer was also detected. We suggest that Ni-P is very critical in obtaining low contact resistance for n-InP.

CL spectroscopy studies at varying temperatures and excitation power densities as well as depth-resolved CL imaging were conducted to investigate the impact of low energy electron beam irradiation (LEEBI) on native defects and residual impurities in metal-organic vapor phase epitaxy (MOVPE) grown Mg-doped p-type GaN. Due to the dissociation of (Mg-H)0 complexes, LEEBI significantly increases the (e,Mg0) emission (3.26 eV) at 300 K and substantially decreases the H-Mg donor-acceptor-pair (DAP) emission (3.27 eV) at 80 K. In-plane and depth-resolved CL imaging indicates that hydrogen dissociation results from electron-hole recombination at H-defect complexes rather than heating by the electron beam. The dissociated hydrogen atoms associate with nitrogen vacancies, forming a deeper donor, i.e. a (H-VN) complex. The corresponding deeper DAP emission with Mg centered at 3.1 eV is clearly observed between 160 and 220 K. Moreover, a broad yellow luminescence (YL) band centered at 2.2 eV is observed in MOVPE-grown Mg-doped GaN after LEEBI-treatment. It is suggested that a combination of LEEBI-induced Fermi-level downshift due to Mg-acceptor activation and simultaneous dissociation of gallium vacancy-impurity complexes, i.e. (VGa-H), is responsible for the observed YL.

Ti/Ni/Au/diamond metal-insulator-semiconductor field effect transistors with TiO2 gate dielectric have been successfully fabricated. In this work, multi-layer metallization on the semiconducting diamond surface was investigated. Post-metallization annealing was performed and EDS analysis was conducted both before annealing and after annealing. Elevated temperature annealing accelerates the diffusion between multi-layer metal and lowers the ohmic contact resistance of the interface. Current-voltage characteristics of the transistor are reported.

We are using cavity ring-down spectroscopy (CRDS) to measure concentrations of water in nitrogen and, for the first time to our knowledge, in phosphine. Water vapor concentrations have been measured in purified and unpurified phosphine, indicating a water mole fraction of (22.0 ± 1.0) x 10-6 in unpurified phosphine. After purification with an in-line, chemically-reactive purifier, the mole fraction of water in phosphine was less than 0.1 × 10-6. Mole fractions as high as (730 ± 60) × 10-6 have been measured in unpurified phosphine, suggesting that the H2O vapor concentration increases substantially with time as the gas is stored in a cylinder. The materials properties of AlInP grown by molecular beam epitaxy (MBE) with CRDS-characterized PH3 were found to be relatively insensitive to water contamination at the 22 mol/mol level.

As one of the few Type I band offset, antimony-based material systems available for 3.3 to 4.2 micron mid-infrared multiple quantum well lasers, AlInAsSb alloys have been used as barriers with InAsSb wells. Previously, AlxIn(1-x)AsySb(1-y) quaternary alloys have been grown by MBE as random alloys up to an aluminum fraction, x = 0.10 on GaSb substrates and x = 0.15 on InAs substrates. Random alloy growth of quaternary films with increased aluminum content, although beneficial to the devices, is limited by a miscibility gap. We have used a digital alloy technique to grow stable, single phase, GaSb lattice-matched, optically smooth quaternary alloys for aluminum fractions of 0.05 to 0.5, well into the miscibility gap. DCXRD results show FWHM of 0th order alloy peaks are within 1.5 to 2 times that of the highly crystalline GaSb substrates and have well defined thickness fringes corresponding to the total film thickness and the digital alloy period. TEM images show very well ordered alloys with characteristic ultrathin superlattice structure having smooth interfaces, very little strain and atomic ordering limited to that imposed by the digital alloy technique. Photoluminescence measurements are used to fit a model for bandgap prediction from known alloy compositions. Theoretical studies have predicted that the addition of a fifth element, gallium, may help suppress Auger recombination through its effects on the subband structure. So, gallium is added to the quaternary to produce a quinternary alloy lattice-matched to GaSb. These AlGaInAsSb alloys have DCXRD and TEM results similar to the quaternary. The stable, single-phase growth of these quinternary alloys across the composition range is promising for improving the operating characteristics of mid-IR lasers.

Effects of MOCVD growth parameters on structural and optical properties of double-quantum-well (DQW) structures containing uncoupled GaInNAs/GaAs and InGaAs/GaAs quantum wells have been investigated. By varying growth temperature, growth rate, V/III ratio, and DMHy flow rates, we have achieved a longer-wavelength emission from a GaInNAs well than from an InGaAs well grown in the same structure. GaInNAs/GaAs multiple-quantum-well structures grown under optimum conditions emitted at 1.25 μm.

Polarized far infrared reflectance was measured at oblique incidence for In0.53Ga0.47As / InP multiple quantum wells grown by chemical beam epitaxy on InP(100) wafers. Both the well thickness (0.25 - 20 nm) and number of periods (10 - 40) were varied. The reflectance spectra contained sharp Berreman modes at the frequencies of the transverse (TO) and longitudinal (LO) optical phonons. The contributions of the individual phonons were resolved with the model fits. Interface layer phonon modes were observed with intensity increasing with number of wells. The interface layers were 0.6 nm thick and of different composition to adjoining wells consistent with cross-sectional scanning tunneling microscope results on the same samples. The variation due to phonon confinement of the InAs- and GaAs-like LO and TO phonon frequencies was obtained.