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A simple integral formulation for the modeling of thin conductive shells*

Published online by Cambridge University Press:  06 November 2013

Tung Le-Duc ,
Gérard Meunier ,
Olivier Chadebec ,
Jean-Michel Guichon  and
Laurent Krähenbühl
Tung Le-Duc*
Affiliation:
Department of Electric Power Systems, School of Electrical Engineering, Hanoi University of Science and Technology, Dai Co Viet Road, 1000 Hanoi, Vietnam
Gérard Meunier
Affiliation:
Grenoble Electrical Engineering Laboratory, University of Grenoble Grenoble-INP/Université Joseph Fourier/CNRS UMR 5269, 11 rue des Mathématiques, BP 46, 38402 Saint-Martin-d’Héres Cedex, France
Olivier Chadebec
Affiliation:
Grenoble Electrical Engineering Laboratory, University of Grenoble Grenoble-INP/Université Joseph Fourier/CNRS UMR 5269, 11 rue des Mathématiques, BP 46, 38402 Saint-Martin-d’Héres Cedex, France
Jean-Michel Guichon
Affiliation:
Grenoble Electrical Engineering Laboratory, University of Grenoble Grenoble-INP/Université Joseph Fourier/CNRS UMR 5269, 11 rue des Mathématiques, BP 46, 38402 Saint-Martin-d’Héres Cedex, France
Laurent Krähenbühl
Affiliation:
Université de Lyon, AMPERE, CNRS UMR 5005, École Centrale de Lyon, 38 av. Guy de Collongue, 69134 Ecully Cedex, France
*
ae-mail: [email protected]
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Abstract

In order to model thin conductive non-magnetic shells, an original surface integral formulation is proposed. The method is based on a surface impedance condition which takes into account the field variation through depth due to skin effect. It is general and enables the modeling of various problems whatever their skin depth and avoiding the meshing of the air region. The formulation is compared with another integral formulation recently proposed by authors and is validated thanks to an axisymmetric finite-element method (FEM). Advantages and drawbacks of this new formulation are discussed.

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 64 , Issue 2 , November 2013 , 24513
Copyright
© EDP Sciences, 2013

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Footnotes

*

Contribution to the Topical Issue “Numelec 2012”, Edited by Adel Razek.

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