Two different methods of deposition of thin layers containing titanium and barium with the use of dielectric barrier discharge were investigated. The first was carried out in two stages. The first stage consisted in transferring compounds containing titanium and barium from the vapor of the organic precursor to the copper substrate, while the second stage involved the etching of the organic layer in oxygen. The second method consisted in transferring titanium and barium to the copper substrate from the ceramic plate made of barium titanate, which was one of the electrodes during the plasma process. The results of analysis obtained by SIMS showed directly that both methods gave a positive result in the deposition of the thin layers containing a certain amount of titanium and barium on the surface of the copper plate. However, more effective method was that involving the properties of reaction with the metallorganic precursor. FTIR study of the layers prepared from the organic precursor indirectly showed that layers deposited on the copper plate contained compounds of barium and titanium. FTIR study also revealed that during the process of etching in oxygen, the organic layer was decreased, but it was not completely removed.