Published online by Cambridge University Press: 15 October 1999
Be diffusion during post-growth annealing has been investigated in InGaAs epitaxiallayers. Kick-out mechanisms considering species charges, built-in electric field andFermi-level effect have been studied. Several forms of kick-out mechanism have beenimplemented in our simulation programs. Experimental concentration profiles obtainedby SIMS analysis have been compared systematically with the numerical results ofsimulations. We have deduced that the kick-out mechanism Bei 0 ↔ Bes − + IIII + is the dominating diffusion mechanism in InGaAsunder our experimental conditions (C 0 = 3 × 19 cm−3). With our experimentaldata, we have found that the effective diffusion coefficient values areD = (7.7−9) × 10−13 cm2 s−1 at T = 700 °C and D = (1.4−1.5) × 10−11 cm2 s−1 at T = 800 °C which is severalorders of magnitude higher than most published data. A possible explanation would bethe effect of V/III flux ratio.