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Application of orthodox defect-selective etching for studying GaN single crystals, epitaxial layers and device structures

Published online by Cambridge University Press:  15 July 2004

G. Kamler*
Affiliation:
High Pressure Research Center, Polish Academy of Sciences, Sokolowska 29/37, 01-142 Warsaw, Poland
J. Borysiuk
Affiliation:
High Pressure Research Center, Polish Academy of Sciences, Sokolowska 29/37, 01-142 Warsaw, Poland
J. L. Weyher
Affiliation:
High Pressure Research Center, Polish Academy of Sciences, Sokolowska 29/37, 01-142 Warsaw, Poland University of Nijmegen, RIM, Exp. Solid State Physics III, Toernooiveld 1, 6525 ED Nijmegen, The Netherlands
A. Presz
Affiliation:
High Pressure Research Center, Polish Academy of Sciences, Sokolowska 29/37, 01-142 Warsaw, Poland
M. Woźniak
Affiliation:
Warsaw University of Technology, Faculty of Materials Science and Engineering, Woloska 141, 02-507 Warsaw, Poland
I. Grzegory
Affiliation:
High Pressure Research Center, Polish Academy of Sciences, Sokolowska 29/37, 01-142 Warsaw, Poland
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Abstract

In this communication, results are presented of the application of etching in molten E+M etch (KOH-NaOH eutectic mixture with 10% MgO) for studying defects in GaN. The method was used to study defects on differently oriented cleavage and basal planes of GaN single crystals, MOCVD-, MBE- and HVPE-grown epitaxial layers and LD and LED structures. Dislocations, dislocation loops and stacking faults have been revealed on $(10\, \bar{\text{\scriptsize 1}}\, 0)$, $(1\,\bar{\text{\scriptsize 2}}\,10)$ and $\{0001\}$ Ga- and N-polar planes. Diversified etch pit morphology was observed depending on the crystallographic orientation of the etched samples and was correlated with the crystallographic symmetry of the GaN lattice. Etching results were calibrated using TEM analysis.

Keywords

Type
Research Article
Copyright
© EDP Sciences, 2004

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