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XRD characterization of texture and internal stress in electrodeposited copper films on Al substrates

Published online by Cambridge University Press:  01 March 2012

Bo Hong ,
Chuan-hai Jiang  and
Xin-jian Wang
Bo Hong
Affiliation:
Key Laboratory for High Temperature Materials and Tests of Ministry of Education, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, 200240, China
Chuan-hai Jiang
Affiliation:
Key Laboratory for High Temperature Materials and Tests of Ministry of Education, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, 200240, China
Xin-jian Wang
Affiliation:
Key Laboratory for High Temperature Materials and Tests of Ministry of Education, School of Materials Science and Engineering, Shanghai Jiaotong University, Shanghai, 200240, China
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Abstract

Internal stresses and textures of electroplated copper films (t=2, 8, 15, 30, 45, and 60) electrodeposited on Al substrates were studied using X-ray diffraction techniques. Results show that the stresses in the films are tensile. The 8 to 60 μm thick films have (220) fiber texture, in good agreement with strain energy minimization calculation. Results also show that a further rotational alignment of the fiber-textured grains was developed, and small amounts of the fiber-textured grains have their (2, −2, 0) planes aligned parallel to the flow direction of the electrodeposited currents. The degree of the rotation alignment increases with film thickness. Values of stress and the degree of texture of copper films were found to be adjustable using an ultrasound technique. Internal stress and the degree of the (220) texture decrease significantly by applying an ultrasound treatment during the electrodeposition process.

Keywords

electrodeposited copper filmtexturestressXRDultrasound
Type
Representative Papers from the Chinese XRD 2006 Conference
Information
Powder Diffraction , Volume 22 , Issue 4 , December 2007 , pp. 324 - 327
Copyright
Copyright © Cambridge University Press 2007

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References

Baker, S. P., Kretschmann, A., and Arzt, E. (2001). “Thermomechanical behavior of different texture components in Cu thin films,” Acta Mater.ACMAFD10.1016/S1359-6454(01)00127-6 49, 2145–2160.CrossRefGoogle Scholar
Barrett, C. S. and Massalski, T. B. (1980). Structure of Metals: Crystallographic Methods, Principles, and Data (Pergamon, Oxford), p. 204.Google Scholar
Carel, R., Thompson, C. V., and Frost, H. J. (1996). “Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin films,” Acta Mater.ACMAFD10.1016/1359-6454(95)00365-7 44, 2479–2494.CrossRefGoogle Scholar
Chiba, A. and Wu, W. C. (1992). “Ultrasonic agitation effects on the electrodeposition of copper from a cupric-EDTA bath,” Plat. Surf. Finish.PSFMDH 79, 62–66.Google Scholar
Compton, R. G., Eklund, J. C., Marken, F., Rebbitt, T. O., Akkermans, R. P., and Waller, D. N. (1997). “Dual activation: coupling ultrasound to electrochemistry—an overview,” Electrochem. Acta 42, 2919–2927.Google Scholar
Hong, B., Jiang, C.-H., and Wang, X.-J. (2006). “Texture of electroplated copper film under biaxial stress,” Mater. Trans.MTARCE10.2320/matertrans.47.2299 47, 2299–2301.Google Scholar
Knorr, D. B. and Tracy, D. P. (1995). “A review of microstructure in vapor deposited copper thin films,” Mater. Chem. Phys.MCHPDR10.1016/0254-0584(95)01515-9 41, 206–216.Google Scholar
Noyan, I. C. and Cohen, J. B. (1987). Residual Stress: Measurement by Diffraction and Interpretation (Springer-Verlag, New York), p. 198.CrossRefGoogle Scholar
Smith, D. L. (1995). Thin-Film Deposition: Principles and Practice (McGraw-Hill, New York), p. 156.Google Scholar
Taylor, A. (1961). X-Ray Metallography (Wiley, New York), p. 172.Google Scholar
Thompson, C. V. and Carel, R. (1995). “Texture development in polycrystalline thin films,” Mater. Sci. Eng., BMSBTEK10.1016/0921-5107(95)03011-5 B32, 211–219.CrossRefGoogle Scholar
Tracy, D. P., Knorr, D. B., and Rodbell, K. P. (1994). “Texture in multilayer metallization structure,” J. Appl. Phys.JAPIAU10.1063/1.357564 76, 2671–2680.Google Scholar
Zhang, J., Xu, K., and He, J. (1999). “Effects of grain orientation on preferred abnormal grain growth in copper films on silicon substrates,” J. Mater. Sci. Lett.JMSLD510.1023/A:1006694414907 18, 471–473.Google Scholar
Zhang, J.-M., Xu, K.-W., and Ji, V. (2001). “Dependence of stresses on grain orientations in thin polycrystalline films on substrates: an explanation of the relationship between preferred orientations and stresses,” Appl. Surf. Sci.ASUSEE10.1016/S0169-4332(01)00243-4 180, 1–5.CrossRefGoogle Scholar
Zhou, L. and Zhu, S. (2002). “Development of a strain induced planar film texture as revealed by molecular dynamics simulation,” Scr. Mater.SCMAF7 47, 677–682.Google Scholar