Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-26T10:07:44.466Z Has data issue: false hasContentIssue false

Omega–Phi compensated GID in side inclination mode for measurement of residual stress in polycrystalline thin films

Published online by Cambridge University Press:  30 January 2018

Xiaodong Wang*
Affiliation:
Bruker Singapore Pte. Ltd., 11 Biopolis Way, #10-10, Helios, 138667, Singapore
Arie van Riessen
Affiliation:
John de Laeter Centre, Curtin University, GPO Box U1987, Perth WA 6845, Australia
*
a)Author to whom correspondence should be addressed. Electronic mail: [email protected]

Abstract

The grazing incidence diffraction (GID) method in side inclination mode, described by Ma et al. in 2002, of polycrystalline thin-film residual stress was revisited and explained using simple geometric relations. To overcome the issue of decreasing peak intensity of this method, which is induced by the decreasing incident angle because of the Eulerian cradle Chi-tilt, an improvement of Omega (ω)–Phi (φ) compensation was devised and applied to a NiFe thin-film sample. The geometry of this improved ωφ compensated GID method in side inclination mode is detailed in this paper. This improvement guarantees a constant incident angle on the sample surface and a fixed sample illumination volume during measurement. The measured data were analysed using parametric refinement in DIFFRAC.TOPAS v6 software in Launch Mode, and details of the input file (.INP) are explained in this paper. The tensile stress of the NiFe thin-film sample was measured to be 1181 ± 85 MPa using this improved method.

Type
Technical Articles
Copyright
Copyright © International Centre for Diffraction Data 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Evans, J. S. O. (2010). “Advanced input files & parametric quantitative analysis using Topas,” Mater. Sci. Forum 651, 19.Google Scholar
Genzel, C. H. (2005). “X-ray residual stress analysis in thin films under grazing incidence – basic aspects and applications,” Mater. Sci. Technol. 21, 1018.Google Scholar
Ma, C.-H., Huang, J.-H., and Chen, H. (2002). “Residual stress measurement in textured thin film by grazing-incidence X-ray diffraction,” Thin Solid Films 418, 7378.Google Scholar
Marciszko, M., Baczmański, A., Wróbel, M., Seiler, W., Braham, C., Donges, J., Śniechowski, M., and Wierzbanowski, K. (2013). “Multireflection grazing incidence diffraction used for stress measurements in surface layers,” Thin Solid Films 530, 8184.Google Scholar
Stinton, G. W. and Evans, J. S. O. (2007). “Parametric Rietveld refinement,” J. Appl. Crystallogr. 40, 8795.Google Scholar
Wang, A.-N., Chuang, C.-P., Yu, G.-P., and Huang, J.-H. (2015a). “Determination of average X-ray strain (AXS) on TiN hard coatings using cos2 α sin2ψ X-ray diffraction method,” Surf. Coat. Technol. 262, 4047.Google Scholar
Wang, A.-N., Huang, J.-H., Hsiao, H.-W., Yu, G.-P., and Chen, H. (2015b). “Residual stress measurement on TiN thin films by combining nanoindentation and average X-ray strain (AXS) method,” Surf. Coat. Technol. 280, 4349.Google Scholar