Hostname: page-component-cd9895bd7-jkksz Total loading time: 0 Render date: 2024-12-23T14:18:49.159Z Has data issue: false hasContentIssue false

Application of energy-dispersive diffraction to the analysis of highly inhomogeneous residual stress fields in thin film structures

Published online by Cambridge University Press:  06 March 2012

M. Klaus
Affiliation:
Technische Universität Berlin, Ernst-Reuter-Platz 1, 10587 Berlin, Germany
W. Reimers
Affiliation:
Technische Universität Berlin, Ernst-Reuter-Platz 1, 10587 Berlin, Germany
Ch. Genzel
Affiliation:
Helmholtz-Zentrum Berlin für Materialien und Energie, Albert-Einstein-Straße 15, 12489 Berlin, Germany

Abstract

For residual stress evaluation in complex substrate-coating systems, energy-dispersive (ED) diffraction with energies up to 100 keV can be applied to analyze the near interface residual stress state in the substrate, because the high energy white beam penetrates the coating completely. By the example of an Al2O3/TiCN on WC coating system we have studied the feasibility for using the coating reflections being stored in the ED diffraction patterns together with the substrate diffraction lines to analyze the residual stress state in individual sublayers of which the coating system consists. The results indicate that the ED method is suitable to detect even steep intralayer stress gradients, if the diffraction conditions are adapted to the coating geometry.

Type
Applications Of Residual Stress Analysis
Copyright
Copyright © Cambridge University Press 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Birkholz, M. (2006). Thin Film Analysis by X-ray Scattering (Wiley-VCH, Weinheim).Google Scholar
Denks, I. A. and Genzel, Ch. (2007). Enhancement of energy-dispersive residual stress analysis,” Nucl. Instrum. Methods Phys. Res. ANIMAER B262, 8794.CrossRefGoogle Scholar
Genzel, Ch. (2005). “X-ray residual stress analysis in thin films under grazing incidence-basic aspects and applications,” Mater. Sci. Technol. 21, 10-18.CrossRefGoogle Scholar
Genzel, Ch., Denks, I. A., Gibmeier, J., Klaus, M., and Wagener, G. (2007). “The materials science synchrotron beamline EDDI for energy-dispersive diffraction analysis,” Nucl. Instrum. Methods Phys. Res. ANIMAER 578, 2333.10.1016/j.nima.2007.05.209CrossRefGoogle Scholar
Genzel, Ch., Stock, C., and Reimers, W. (2004). “Application of energy-dispersive diffraction to the analysis of multiaxial residual stress fields in the intermediate zone between surface and volume,” Mater. Sci. Eng., AMSAPE3 372, 2843.10.1016/j.msea.2003.09.073CrossRefGoogle Scholar
Hauk, V. (1997). Structural and Residual Stress Analysis by Nondestructive Methods (Elsevier, Amsterdam).Google Scholar
Klaus, M., Genzel, Ch., and Holzschuh, H. (2008a). “Residual stress depth profiling in complex hard coating systems by X-ray diffraction,” Thin Solid FilmsTHSFAP 517, 11721176.10.1016/j.tsf.2008.05.018CrossRefGoogle Scholar
Klaus, M., Genzel, Ch., and Holzschuh, H. (2008b). “X-ray residual stress analysis in CVD multilayer systems: Influence of steep gradients on the line profile shape and -symmetry,” Z. Kristallogr.ZEKRDZ 27, 273285.CrossRefGoogle Scholar
Landoldt-Börnstein (1979).New Series, Group III (Springer, Berlin), Vol. 11.Google Scholar
Noyan, I. C., Huang, T. C., and York, B. R. (1995). “Residual stress/strain analysis in thin films by X-ray diffraction,” Crit. Rev. Solid State Mater. Sci.CCRSDA 20, 125–77.10.1080/10408439508243733CrossRefGoogle Scholar
Ruppersberg, H. and Detemple, I. (1993). “Evaluation of the stress field in a ground steel plate from energy-dispersive X-ray diffraction experiments,” Mater. Sci. Eng., AMSAPE3 161, 4144.10.1016/0921-5093(93)90473-RCrossRefGoogle Scholar
Zschenderlein, U., Kämpfe, B., Schultrich, B., and Fritsche, G. (2007). “Diffus. defect. data,” Phys. Rev. BPRBMDO 130, 3944.Google Scholar