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The Yield Stress of the Fully-Lamellar Microstructure

Published online by Cambridge University Press:  15 February 2011

Y. Q. Sun
Y. Q. Sun*
Affiliation:
Wright Laboratory, Materials Directorate, WL/MLLM, and Systran Corp., Dayton, Ohio, USA.
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Abstract

This paper is an inquiry into the relationship between the yield stress and the two length parameters in the fully-lamellar polycrystalline microstructure, the grain-size dCB and the lamellar thickness dLM. Deformation in the multilayer structure is assumed to proceed by dislocations propagating in the formation of a succession of mutually interacting pileups, blocked at the lamellar interfaces and piled-up ultimately against the grain boundary. An important case suggested is a yield stress independent of the grain size, sensitive only to the lamellar spacing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 460: Symposium Z – High-Temperature Ordered Intermetallic Alloys VII , 1996 , 109
Copyright
Copyright © Materials Research Society 1997

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References

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