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Yield Strength Enhancement in Multilayer Thin Films by Modulus Hardening

Published online by Cambridge University Press:  22 February 2011

James E. Krzanowski
James E. Krzanowski*
Affiliation:
Mechanical Engineering Dept., University of New Hampshire, Durham, NH 03824
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Abstract

The modulus hardening mechanism for yield strength enhancement in multilayer materials is theoretically investigated. The multilayer composition profile used in the analysis has a general trapezoidal shape with allowance for two different layer thicknesses and two interface widths. The image force method is used to determine effective stresses on dislocations in the multilayer structure. Analytical expressions are derived for the effective stresses in terms of the shear elastic moduli. Calculations are carried out for representative composition profile shapes. It is found that the dislocation experiences the maximum effective stress when it is in the interface between layers, and that the effective stress increases dramatically with decreasing interface width. However, the effective stress is not strongly affected by either the multilayer wavelength or the relative thickness of the layers.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 509
Copyright
Copyright © Materials Research Society 1992

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References

REFERENCES

1. Tench, D. and White, J., Metall. Trans. 15A 2039 (1984).Google Scholar
2. Parker, C.A., Metall. Trans. 16A 1693 (1985).CrossRefGoogle Scholar
3. Lehoczky, S.L., J. App. Phys. 49 5479 (1978).Google Scholar
4. Bunshah, R.F., Niramagadda, R., Doerr, H.J., Movchan, B.A., Grechanuk, N.I., and Dabizha, E.V., Thin Solid Films 72 261 (1980).Google Scholar
5. Cammarata, R.C., Schlesinger, T.E., Kim, C., Qadri, S.B., and Edelstein, A.S., Appl. Phys. Lett. 56 1862 (1990).Google Scholar
6. Yoshii, K., Takagi, H., Umeno, M., and Kawabe, H., Metall. Trans. 15A 1273 (1984).Google Scholar
7. Barai, D., Ketterson, J.B., and Hilliard, J.E., J. Appl. Phys. 57 1076 (1985).Google Scholar
8. Koehler, J.S., Phys. Rev. B 2 547 (1970).Google Scholar
9. Krzanowski, J.E., Scripta metall. et mater. 25 1465 (1991).Google Scholar
10. Krzanowski, J.E., to be published.Google Scholar
11. Fleischer, R.L., Acta Metall. 8, 598 (1960).Google Scholar
12. Kamat, S.V., Hirth, J.P. and Carnahan, B., Scripta metall. 21 1587 (1987).Google Scholar
13. Meyers, M.A. and Chawla, K.K., Mechanical Metallurgy (Prentice-Hall, Englewood Cliffs, NJ, 1984), p. 58; p. 194.Google Scholar