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X-Ray Diffraction Determination of Texture and Stress in Damascene Fabricated Copper Interconnects

Published online by Cambridge University Press:  10 February 2011

Delrose Winter
Affiliation:
AMIA Laboratories (Advanced Materials Instruments and Analysis, Inc.) 7801 N. Lamar Blvd. Austin, TX 78752
Paul R. Besser
Affiliation:
Advanced Micro Devices, Inc. One AMD Place. Sunnyvale. CA 94088
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Abstract

X-Ray diffraction (XRD) provides an excellent tool for the measurement of both stress and texture (preferred orientation) on fabricated damascene interconnect structures. Since x-ray diffraction provides a direct measurement of lattice spacings, film strain can be measured directly. Also, since the intensity of diffracted x-rays is proportional to the density of lattice planes oriented in diffracting condition with respect to the incident beam, both the direction and extent of preferred orientation can be accurately measured. Special techniques and considerations are necessary when examining damascene interconnect structures with XRD which are not necessary with blanket films. These techniques are discussed and described in order to aid in obtaining meaningful XRD data and a correct interpretation of the results.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

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