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Whole-field Displacement Measurement Techniques for Thermal Deformation Analyses of Electronic Packages

Published online by Cambridge University Press:  10 February 2011

Bongtae Han
Bongtae Han*
Affiliation:
Mechanical Engineering Department, Clemson University, Clemson, SC 29634, [email protected]
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Abstract

Features and recent developments of various photomechanics methods are reviewed for thermal deformation analyses of electronic packages. Applications to diverse problems are illustrated to demonstrate wide applicability of the methods. The whole-field displacement information, with various sensitivity and resolution scales, is ideally suited for the deformation study of a broad range of problems in deformation analyses of electronic packaging. The methods are mature and they can be practiced routinely. A more extensive range of applications are anticipated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 167
Copyright
Copyright © Materials Research Society 1998

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References

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