Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-29T09:40:35.479Z Has data issue: false hasContentIssue false
  • English
  • Français

Viscoelastic Behavior of Polymer Thin‐Films Under Thermal Stresses

Published online by Cambridge University Press:  10 February 2011

Stephen D. Bluestein ,
Dewi P. Y. Bramono ,
Ioannis N. Miaoulis  and
Peter Y. Wong
Peter Y. Wong
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, MA 02155
Get access

Abstract

Stresses and deformation in microelectronic packaging are affected by the viscoelastic behavior of polymer materials during manufacture or operation. Predicting and measuring these thermo‐mechanical effects is important for new devices, components, and materials. The viscoelastic response of Nycoa 851 polyimide thin‐films during thermal loading is investigated. The time‐dependent relaxation of polyimide films was measured in‐situ, focusing on the change in thermo‐mechanical properties based on the thickness of the polyimide layer. The curvature change of the multilayer structure (silver‐polyimide‐quartz heterostructure) was obtained for different temperatures and polymer film thicknesses. The polyimide relaxation time constant and activation energy were determined. Results indicate that the thermo‐mechanical properties of polyimide thin films are dependent on the thickness of the polymer layer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 185
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Seraphim, D. P., Lasky, R., and Li, C.‐Y., Electronic Packaging. (McGraw‐Hill Book Company, New York, 1989), p. 127, 298, 351Google Scholar
2 Pecht, M. and Wu, X., IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 17, pp. 632–639 (1994).Google Scholar
3 Madras, C., Wong, P. Y., and Miaoulis, I. N., Polymer/Inorganic Interfaces II. edited by Drzal, L. T., Opila, R. L., Peppas, N. A., and Schutte, C. (Mat. Res. Soc. Symp. Proc, 385, Pittsburgh, PA, 1995) pp. 71–76.Google Scholar
4 Matsuoka, S., Relaxation Phenomena in Polymers. (Oxford University Press, New York, 1992), p. 9, 43–49.Google Scholar
5 Aklonis, J. J., MacKnight, W. J. and Shen, M., Introduction to Polymer Viscoelasticity. (John Wiley & Sons Inc., New York, 1972), p. 145.Google Scholar
6 Ward, I. M. and Hadley, D. W., An Introduction of the Mechanical Properties of Solid Polymers. (John Wiley & Sons Inc., New York, 1993), p. 58.Google Scholar