Hostname: page-component-cd9895bd7-lnqnp Total loading time: 0 Render date: 2024-12-27T02:19:42.501Z Has data issue: false hasContentIssue false

Using Thermal Oxidation and Rapid Thermal Annealing on Polycrystalline-SiGe for Ge Nanocrystals

Published online by Cambridge University Press:  01 February 2011

Chyuan-Haur Kao
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan, +886-3-2118800-5783, +886-3-2118507
C. S. Lai
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan
M. C. Tsai
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan
C. H. Lee
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan
C. S. Huang
Affiliation:
[email protected], Chang Gung University, Electronics Engineering, 259 Wen-Hwa 1st Road, Kwei-Shan, Tao-Yuan, 333, Taiwan
C. R. Chen
Affiliation:
[email protected], Material Science Service Corporation, Hsin Chu, 300, Taiwan
Get access

Abstract

In this paper, simple techniques were proposed to fabricate germanium nanocrystal capacitors by one-step thermal oxidation and/or rapid thermal annealing on polycrystalline-SiGe (poly-SiGe) deposited with a LPCVD (low pressure chemical vapor deposition) system. This thermal oxidation method can directly result in the top-control oxide layer via the oxidation of amorphous-Si film and the formation of Ge nanocrystals from the poly-SiGe film. Otherwise, the rapid thermal annealing method can be also used to form Ge nanocrystals as comparison.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]. Hanafi, H. I. Tiwari, S. and Khan, I. IEEE Electron. Devices. 43, (1996) 1553.Google Scholar
[2]. King, Ya-Chin, King, Tsu-Jae, and Hu, Chenming, IEDM Tech. Dig., (1998), p. 115.Google Scholar
[3]. Liu, Z. Lee, C. Narayanan, V. Pei, G. Kan, E. C. IEEE Electron. Devices. 49, (2002) 1606.Google Scholar
[4]. Chen, J. H. Wang, Y. Q. Yoo, W.J. Yeo, Y. C. Samudra, Ganesh, Chan, Daniel SH, Du, A. Y. Kwong, D. L. IEEE Electron. Devices. 51, (2004) 1840.Google Scholar