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A Universal CMP Process Description Language for Standardization

Published online by Cambridge University Press:  01 February 2011

Takafumi Yoshida
Takafumi Yoshida*
Affiliation:
YNT-jp.Com 2-10-17 Asae, Hikari, Yamaguchi 743-0021, Japan
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Abstract

This paper proposes a universal Chemical Mechanical Planarization (CMP) process description language. We discuss the appropriate attributes needed to describe complex CMP processes and the capability for the standardization of CMP. We show an implementation of the language based on an open standard.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W2.9
Copyright
Copyright © Materials Research Society 2005

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References

1. ITRS, International Technology Roadmap for Semiconductors (2004)Google Scholar
2. Steigerwald, J. M., Murarka, S. P., Gutmann, R. J., “Chemical Mechanical Planarization of Microelectronic Materials” (1997)Google Scholar
3. Gibbs, W. W., “Software's Chronic Crisis,” Scientific American, Sept., 86 (1994)Google Scholar
4. SEMI, Semiconductor Equipment and Materials International, http://www.semi.org/Google Scholar
5. International SEMATECH, http://www.sematech.org/Google Scholar
6. W3C, The World Wide Web Consortium, http://www.w3c.org/XML/Google Scholar
7. RosettaNET, http://www.rosettanet.org/Google Scholar
8. CMPxML, http://www.ynt-jp.com/siliconlab/CMPxML/Google Scholar
9. Skonnard, A., Gudgin, M., “Essential XML Quick Reference,” Addison-Wesley (2002)Google Scholar