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Uniform Low-Temperature Deposition of Optical Layers by Plasma-Activated CVD

Published online by Cambridge University Press:  25 February 2011

Hans Lydtin
Affiliation:
Philips Research Laboratories, P.O. Box 1980, D-5100 Aachen, Germany
Arnd Ritz
Affiliation:
Philips Research Laboratories, P.O. Box 1980, D-5100 Aachen, Germany
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Abstract

Plasma activated CVD in a remote operation mode is applied to the deposition of dielectric layers on extended substrates. Layer thickness uniformity of ±1% over areas of 80mm diameter is demonstrated. The microwave applicator sustaining the plasma source of condensable species is compared in its deposition characteristic to conventional evaporation sources. Deposition efficiencies up to 70% are reached. The layer materials used are SiO2 and TiO2. Multilayer structures are prepared and optically characterized.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

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References

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