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Published online by Cambridge University Press: 25 February 2011
Plasma activated CVD in a remote operation mode is applied to the deposition of dielectric layers on extended substrates. Layer thickness uniformity of ±1% over areas of 80mm diameter is demonstrated. The microwave applicator sustaining the plasma source of condensable species is compared in its deposition characteristic to conventional evaporation sources. Deposition efficiencies up to 70% are reached. The layer materials used are SiO2 and TiO2. Multilayer structures are prepared and optically characterized.