Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-25T17:33:43.075Z Has data issue: false hasContentIssue false
  • English
  • Français

Ultrasonic Characterization of Thin Adhesive Bonds

Published online by Cambridge University Press:  21 February 2011

P. Dickstein ,
A. N. Sinclairw ,
E. Segal  and
Y. Segal
P. Dickstein
Affiliation:
Department of Mechanical Engineering, 5 King's College Road, Toronto, Canada M5S-1A4
A. N. Sinclairw
Affiliation:
Department of Mechanical Engineering, 5 King's College Road, Toronto, Canada M5S-1A4
E. Segal
Affiliation:
Department of Nuclear Engineering, Technion-Israel Institute of Technology, Haifa, Israel-32000
Y. Segal
Affiliation:
Department of Nuclear Engineering, Technion-Israel Institute of Technology, Haifa, Israel-32000
Get access

Abstract

A series of nondestructive and destructive tests were performed on samples of aluminumto-aluminum bonded plates. The specimens featured a range nominal thickness of the adhesive layer from 0.0 up to 0.5 mm. It was found that a commercial bondtester was inappropriate for assessing the thickness of the adhesive in this range. However, the frequency peak of an ultrasonic echo signal from the adhesive layer was a reliable indicator of bond thickness. It is proposed that nondestructive assessments of the bond thickness could serve as an indicator of the longterm resistance of the adhesive to water ingress and bond degradation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 142: Symposium U – Nondestructive Monitoring of Materials Properties , 1988 , 349
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Bickerman, J.J., The Science of Adhesive Joints, 2nd ed. (Academic Press, New York and London, 1968).Google Scholar
2. Maclver, G.M. and Thompson, D.P. II, in: Adhesives in Manufacturing, edited by Schneberger, L., (Marcel Dekker Inc., New York and Basel, 1983).Google Scholar
3. Anderson, G.P., Bennett, S.J. and DeVries, K.L., Analysis and Testing of Adhesive Bonds, (Academic Press, 1977).Google Scholar
4. Knollman, G.C., Int. J. Adhes. 5, (3), 137–141, (1985).CrossRefGoogle Scholar
5. Lloyd, E.A. and Wadhwani, D.S., in: Adhesion 4, edited by Allen, K.W., (Applied Science Publishers Ltd., London, 1980).Google Scholar
6. Venables, J.D., McNamara, D.K., Chen, J.M., Sun, T.S. and Hopping, R.L. in: 10th Nat. SAMPE Tech. Conf., 362, 1978.Google Scholar
7. Kedem, B., Proc. IEEE, 74, 11, (1986).CrossRefGoogle Scholar
8. Dickstein, P., D. Sc Thesis, Technion - Israel Institute of Technology, 1988.Google Scholar
9. Biggiero, G., Canella, G. and Moschini, A., NDT International, 1983, 4.Google Scholar
10. Biggiero, G. and Canella, G., Int. J. Adhes., 5, 3 (1985).CrossRefGoogle Scholar
11. Russell, W.J. and Westerdahl, C.A.L., in: Corrosion Control by Coatings, edited by Leidheiser, H. Jr., (Science Press, Princeton, 1979).Google Scholar
12. Brockmann, W.G., in: Structural Adhesives in Enlineering, (Mechanical Engineering Publications Ltd., London 1988).Google Scholar
13. Hartshorn, S.H., in: Structural Adhesives. Chemistry and Technology, edited by Hartshorn, S.H., (Plenum Press, 1986).Google Scholar
14. Dickstein, P., Segal, E. and Segal, Y., in: Nondestructive Testing, edited by Fraely, J.M. and Nichols, R.V., (Plenum Press, 1987).Google Scholar