Ultra fine particles(UFP) of organic and inorganic materials can be formed by the gas evaporation method(gas condensation method). In the gas deposition method, particles formed by the gas evaporation method in an evaporation chamber are carried to another chamber (a deposition chamber) through a pipe. Particles are accelerated in the pipe with a gas flow and come out of a nozzle located in the deposition chamber which is being evacuated down to less than 10 torr and deposited on a substrate to form UFP films. The final speed of the particles depends on the pressure difference between the evaporation chamber and the deposition chamber. The particles speed exceeds 500m/s and adhesion strengths of the films reach 50OKgf/cm2 as well as vacuum deposition films in the condition that the pressure of the evaporation chamber is at 4 atms. Patterns of spots and lines with 50μm size and also wider films can be formed on a substrate without a masking system. The process is effective for repairing electric connecting lines or producing electrodes and condensers on an industrial scale.