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Tribological Experiments Applied to Tungsten Chemical Mechanical Polishing

Published online by Cambridge University Press:  10 February 2011

Marc Bielmann ,
Uday Mahajan ,
Rajiv K. Singh ,
Pankaj Agarwal ,
Stefano Mischler ,
Eric Rosset  and
Dieter Landolt
Marc Bielmann
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611
Uday Mahajan
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611
Rajiv K. Singh
Affiliation:
Department of Materials Science and Engineering, University of Florida, Gainesville, FL 32611
Pankaj Agarwal
Affiliation:
Department of Materials Science, Ecole Polytechnique Federale Lausanne, Lausanne, Switzerland
Stefano Mischler
Affiliation:
Department of Materials Science, Ecole Polytechnique Federale Lausanne, Lausanne, Switzerland
Eric Rosset
Affiliation:
Department of Materials Science, Ecole Polytechnique Federale Lausanne, Lausanne, Switzerland
Dieter Landolt
Affiliation:
Department of Materials Science, Ecole Polytechnique Federale Lausanne, Lausanne, Switzerland
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Abstract

Tungsten CMP involves a synergistic interaction of electrochemical and tribological (wear) phenomena. So far, numerous studies have been conducted using static electrochemical measurements as well as some polishing experiments. In this study, we present some results obtained from carrying out potentiodynamic measurements and tribological experiments in a reciprocating sphere-on-plate tribometer, which allowed a precise control of mechanical and electrochemical conditions. In addition, anodic current-time transient measurements were also used to characterize the kinetics of tungsten passivation reaction. These results indicate that the presence of an passive film is essential for wear of tungsten to take place.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 97
Copyright
Copyright © Materials Research Society 2000

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References

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