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Toward Measurement of Thin Film Properties by Enhanced Moire Interferometry

Published online by Cambridge University Press:  25 February 2011

Arkady S. Voloshin ,
Fazil Erdogan  and
Leng-Tsun Tsai
Arkady S. Voloshin
Affiliation:
Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015
Fazil Erdogan
Affiliation:
Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015
Leng-Tsun Tsai
Affiliation:
Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015
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Abstract

Growing use of thin films in encapsulated integrated circuits(IC's) necessitated new developments in measurement of their mechanical properties in-situ. This can be done by a hybrid analytical experimental approach. The films are approximated by orthotropic membranes and the substrate is assumed to be an elastic continuum. It can be shown that power of stress singularity is a function of geometry and film/substrate material properties. By loading the sample and measuring actual displacement field in the close proximity to the crack or edge, one can evaluate the needed properties.

The technique used to measure full field displacements is enhanced moire' interferometry. It is based on the formation of fringes by the coexistence of light wave fronts diffracted from a specimen grating of high frequency. These specimen gratings are created on the specimen surface using a replication technique from a specially prepared mold. Two beams of coherent laser light illuminate the specimen grating obliquely to create a virtual reference grating in front of the specimen. The frequency f of this grating is chosen to be 2400 lines/ mm, this corresponds to a sensitivity of 0.417 µk per fringe order. When the specimen is deformed the interference pattern (moire' fringes) is formed and collected by a video camera connected to a PC-based digital image processor. Analysis of the moire pattern results in full field displacement.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 183
Copyright
Copyright © Materials Research Society 1991

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References

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