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Toughened, Inorganic-Organic Hybrid Materials for Microelectronic Application

Published online by Cambridge University Press:  15 February 2011

J. L. Hedrick ,
S. Srinivasan ,
H.-J. Cha ,
D. Yoon ,
V. Flores ,
M. Harbison ,
R. Di Pietro ,
W. Hinsberg ,
V. Deline  and
H. R. Brown
...Show all authors
J. L. Hedrick
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
S. Srinivasan
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
H.-J. Cha
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
D. Yoon
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
V. Flores
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
M. Harbison
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
R. Di Pietro
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
W. Hinsberg
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
V. Deline
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
H. R. Brown
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
M. Sherwood
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
E. Paulson
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
R. D. Miller
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120–6099
R. Cook
Affiliation:
IBM T. J. Watson Research Lab, Yorktown Heights, NY
E. Liniger
Affiliation:
IBM T. J. Watson Research Lab, Yorktown Heights, NY
E. Simonyi
Affiliation:
IBM T. J. Watson Research Lab, Yorktown Heights, NY
D. Klaus
Affiliation:
IBM T. J. Watson Research Lab, Yorktown Heights, NY
S. Cohen
Affiliation:
IBM T. J. Watson Research Lab, Yorktown Heights, NY
J. Hummel
Affiliation:
IBM T. J. Watson Research Lab, Yorktown Heights, NY
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Abstract

Transparent, nanophase-separated, inorganic-organic hybrid polymers with dielectric constants below 3.0 have been prepared from reactively functionalized poly(amic ester) derivatives and substituted, oligomeric silsesquioxanes. These hybrid materials are stable to 400 °C and above and form tough, crack-free films. Induced cracking and crack propagation studies performed with the application of external stress suggest a maximum critical film thickness of at least 2.0 μm under severe stress conditions. These hybrid materials appear to be significantly toughened by the chemical incorporation of the polyimides relative to organically modified silicates and spin-on-glasses without significantly effecting other important polymer properties of the silicates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 443: Symposium H – Low-Dielectric Constant Materials II , 1996 , 47
Copyright
Copyright © Materials Research Society 1997

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