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Top Gate Self-Aligned μc-Si TFTs using Layer-by-Layer Method and Ion-doping Method

Published online by Cambridge University Press:  14 March 2011

Yukihiko Nakata
Affiliation:
Sharp Laboratories of America, LCD Process Tech. Department 5700 NW Pacific Rim Boulevard, Camas, WA 98607, U.S.A.
Yasuaki Murata
Affiliation:
Sharp Corporation, LCD Development Group 2613-1, Ichinomoto-cho, Tenri, Nara 632-8567, Japan
Masaya Hijikigawa
Affiliation:
Sharp Corporation, LCD Development Group 2613-1, Ichinomoto-cho, Tenri, Nara 632-8567, Japan
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Abstract

We investigated the Layer-by-Layer method to obtain thin μc-Si films. Good quality μc-Si films can be obtained at a thickness of 600 Å Ion-doping of phosphor to i-type μc-Si was investigated to realize the top-gate, self-aligned μc-Si TFT. High conductivity, more than 1 ohm-cm, can be obtained. Using the combination of Layer-by-Layer deposition method and ion-doping method, we fabricated top gate self-aligned μc-Si TFTs. The mobility of TFTs with 600Å-thick μc-Si channel layer is 1.5 cm2/Vs, which is about three times that of a-Si TFT's mobility. The top gate self-aligned μc-Si TFT is very promising technology for large LCD with high mobility.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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