Hostname: page-component-669899f699-2mbcq Total loading time: 0 Render date: 2025-04-25T01:30:59.168Z Has data issue: false hasContentIssue false
  • English
  • Français

Three-Dimensional Integration of Silicon Chips for Automotive Applications

Published online by Cambridge University Press:  26 February 2011

Werner Weber
Werner Weber*
Affiliation:
[email protected], Infineon Technologies, AIM TI MU FP, Am Campeon 1-12, Munich, 81726, Germany, +498923448470, +49892349557ß82
Get access

Abstract

Currently, 3D integration of semiconductor chips is introduced into high-volume products. While memory and communication will be leading fields of application, automotive will require specific non-standard solutions some of which are in research or development whereas others have already been introduced to production. This paper elaborates on the different opportunities and constraints of automotive applications, presents different technological options and discusses specific solutions considered in research or found in already existing products.

Keywords

bondingpackagingthin film
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 970: Symposium Y – Enabling Technologies for 3-D Integration , 2006 , 0970-Y03-01
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1. Hayashi, Y., Oyama, K., Takahashi, S., Wada, S., Kajayana, K., Koh, R., and Kunio, T., IEDM Techn Digest, pp.657–660, 1991.Google Scholar
2. Takahashi, S., Hayashi, Y., Kunio, T., Endo, N., Proc. MCMC, pp. 159–162, 1992.Google Scholar
3. Takata, H., Nakano, T., Yokoyama, S., Horiuchi, S., Itani, H., Tsukamoto, H. and Koyanagi, M., “A Novel Fabrication Technology for Optically Interconnected Three-Dimensional LSI by Wafer Aligning and Bonding Technique”, Intern. Semiconductor Device Research Symposium, pp.327–330, 1991.Google Scholar
4. Matsumoto, T., Kudoh, Y., Tahara, M., Yu, K-H., Miyakawa, N., Itani, H., Ichikizaki, T., Fujiwara, A., sukamoto, H. and Koyanagi, M., Extended Abstracts of the 1995 International Conference on Solid State Devices and Materials (SSDM), pp.1073–1074, 1995 Google Scholar
5. Ramm, P., Bollmann, D., Braun, B., Buchner, R., Cao-Minh, U., Engelhardt, M., Errmann, G., Graßl, T., Hieber, K., Hübner, H., Kawala, G., Kleiner, M., Klumpp, A., Kühn, S., Landesberger, C., Lezec, H., Muth, W., Pamler, W., Popp, R., Renner, E., Ruhl, G., Sänger, A., Scheler, U., Schertel, A., Schmidt, C., Schwarzl, S., Weber, J., and Weber, W., Invited lecture in Microelectronic Engineering 37/38, pp. 39–47, 1997.Google Scholar
6. Engelhardt, M., Hübner, H., Jacobs, H., Kleiner, M., Kühn, S., Pamler, W., Renner, E., Sänger, A., Schmidt, C., Schwarzl, S., and Weber, W., Braun, B., Graßl, T., Hieber, K., Kawala, G., Klumpp, A., Landesberger, C., Popp, R., Ramm, P., Ruhl, G., and Weber, J., CIP '97 Proceedings, Proc. 11th International Colloquium on Plasma Processes, pp. 187–192, 1997, Supplément à la Revue Le Vide: science, technique et applications; No 284, Avril-Mai-Juin 1997, Editor: Société Francaise du Vide, 19 rue du Renard, 75004 Paris, FranceGoogle Scholar
7. Kühn, S. A., Kleiner, M. B., Ramm, P., and Weber, W., IEDM Tech. Digest, pp. 249–252, 1995.Google Scholar
8. Kleiner, M. B., Kühn, S. A., Ramm, P., and Weber, W., IEDM Tech. Digest, pp. 487–490, 1995.Google Scholar
9. Kleiner, M. B., Kühn, S. A., and Weber, W., IEEE Trans. Electron Devices, 43, pp. 1602–1609, 1996.Google Scholar
10. Kleiner, M. B., Kühn, S. A., Ramm, P., and Weber, W., IEEE Trans. Components, Packaging, and Manufacturing Technology - Part B: Advanced Packaging, 19, pp. 709–718, 1996.Google Scholar
11. Kühn, S. A., Kleiner, M. B., Ramm, P., and Weber, W., IEEE Trans. Components, Packaging, and Manufacturing Technology - Part B: Advanced Packaging, 19, pp. 719–727, 1996.Google Scholar
12. Kühn, S. A., Kleiner, M. B., and Weber, W., J. of Systems Architecture, 43, pp. 7–14, 1997.Google Scholar
13. Klumpp, A., Merkel, R., Ramm, P., Weber, J., and Wieland, R., Jap.J. Appl. Phys., 43, pp. L829–830, 2004.Google Scholar
14. Miura, N., Mizoguchi, D., Inoue, M., Niitsu, K., Nakagawa, Y., Tago, M., Fukaishi, M., Sakurai, T., Kuroda, T., ISSCC Tech. Digest, pp. 424–425, 2006.Google Scholar
15. Kriechbaum, A., and Bauer, W., Proc. 4th European Microelectronics and Packaging Symposium, Catez ob Savi, Slovenia, pp. 129–134, 2006.Google Scholar