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Thin Film Fracture During Nanoindentation of Hard Film – Soft Substrate Systems

Published online by Cambridge University Press:  21 March 2011

M. Pang ,
K.D. Weaver  and
D.F. Bahr
M. Pang
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164-2920
K.D. Weaver
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164-2920
D.F. Bahr
Affiliation:
Mechanical and Materials Engineering, Washington State University, Pullman WA 99164-2920
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Abstract

Nanoindentation testing of hard film – soft substrate systems can exhibit permanent deformation prior to a yield excursion, indicating that the occurrence of this sudden discontinuity is predominantly controlled by the hard film cracking rather than dislocation nucleation and multiplication. In a previous paper, a model was developed to predict the mechanical response prior to hard film fracture. In the current study a this model, which superimposes large deflection of the hard film and plastic deformation of the substrate the model, is further refined by testing a variety of materials with different film formation conditions. The tested materials include anodic titanium oxide on titanium, thermal aluminum oxide on aluminum and sputtered tungsten films on aluminum. The film fracture strength of titanium oxides on titanium is estimated as 15 GPa and that of aluminum oxides on aluminum is around 10 GPa. In the case of vacuum sputtered tungsten film on aluminum, the tungsten layer is likely plastically deformed. The strain at film fracture is roughly estimated to be 3.4%.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L7.2.1
Copyright
Copyright © Materials Research Society 2002

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References

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