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Thin Film Decohesion and Its Measurement
Published online by Cambridge University Press: 15 February 2011
Abstract
The mechanics of thin films are used to define quantitative procedures for predicting interface decohesion motivated by residual stress. The emphasis is on the role of the interface debond energy, especially methods for its accurate and reliable measurement. Experimental results are reviewed and possible mechanisms are discussed.
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- Copyright © Materials Research Society 1995
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