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Thin Film Bulk Acoustic Wave Resonators for Continuous Monitoring in the Physical, Chemical and Biological Realms

Published online by Cambridge University Press:  31 January 2011

Greg Ashley ,
Jack Luo ,
Paul Kirby ,
Timothy Butler  and
David Cullen
Greg Ashley
Affiliation:
[email protected], University of Bolton, CMRI Microsystems, Bolton, United Kingdom
Jack Luo
Affiliation:
[email protected], University of Bolton, CMRI Microsystems, Bolton, United Kingdom
Paul Kirby
Affiliation:
[email protected], Cranfield, Microsytems and Nanotechnology Centre, Cranfield, United Kingdom
Timothy Butler
Affiliation:
[email protected], Cambridge University, CAPE, Cambridge, United Kingdom
David Cullen
Affiliation:
[email protected], Cranfield, Microsytems and Nanotechnology Centre, Cranfield, United Kingdom
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Abstract

A transducer that can act as a highly sensitive and reliable universal sensor capable of detecting and continuously monitoring changes in the physical, chemical and biological domains is a potentially useful scientific tool. The Thin Film Bulk Acoustic Wave Resonator (FBAR) is a microwave device that is becoming increasingly recognised as a universal transduction platform with the added advantage of potential integration into CMOS architecture and array-like formats. This work shows preliminary results on FBAR where a continuous monitoring arrangement demonstrated the capability of FBAR to respond to changes in physical parameters such as temperature and light levels, the work goes on further to show the ability of FBAR to respond to changes in humidity in a gas flow and can have sensitivity increased with the addition of hygroscopic polymers on its surface and finally how FBAR can be adapted to act as a biosensor in the form of an immunosensor with sensitivity some orders of magnitude greater than traditional lower frequency bulk acoustic wave platforms.

Keywords

acousticsensormicroelectro-mechanical (MEMS)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1222: Symposium DD – Microelectromechanical Systems — Materials and Devices III , 2009 , 1222-DD02-18
Copyright
Copyright © Materials Research Society 2010

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