Hostname: page-component-78c5997874-s2hrs Total loading time: 0 Render date: 2024-11-09T06:23:25.770Z Has data issue: false hasContentIssue false
  • English
  • Français

Thin Film Adhesion Study in Microelectronic Packaging

Published online by Cambridge University Press:  22 February 2011

H. S. Jeong ,
Y. Z. Chu ,
M. B. Freiler ,
C. Durning  and
R. C. White
H. S. Jeong
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
Y. Z. Chu
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
M. B. Freiler
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
C. Durning
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
R. C. White
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
Get access

Abstract

Fracture energy (Ga) of BPDA-PDA polyimide (PI) on modified and unmodified Si surfaces was measured by the “blister” test as a function of final cure temperature. It is proven quantitatively that surface modification prior to thin film deposition enhances adhesion. Metal adhesion to PI was also measured by the same method. Reproducibility of the data was found to be exceptionally good for both cases. The linear elastic model is quite valid for the test of thin film adhesion. Therefore, it is believed that this test is best suited for Ga measurements in the study of thin film adhesion for microelectronic packaging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 239: Symposium D – Thin Films: Stresses and Mechanical Properties III , 1991 , 547
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Baglin, J.E.E., Clark, G.J. and Bottiger, J., Mater. Res. Soc. Symp. Proc. 25, 179 (1984)Google Scholar
2. Jeong, H.S., Chu, Y.Z., Durning, C. and White, R.C., to appear in Surf. Interface Anal., Feb. (1992)Google Scholar
3. Chu, Y.Z. and Durning, C., to appear in J. Appl. Polym. Sci., (1992).Google Scholar
4. Wu, S., Polymer Interface and Adhesion, (Dekker, New York, 1982), p. 339.Google Scholar
5. Gent, A.N. and Lewandowski, L.H., J. Appl. Polym. Sci., 33, 1567 (1987)Google Scholar