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Thermophysical Properties of Ni Films for LIGA Microsystems

Published online by Cambridge University Press:  01 February 2011

Diana-Andra Borca-Tasciuc ,
Rajesh Nimbalkar ,
Gang Chen ,
Samuel Graham  and
Theodorian Borca-Tasciuc
Diana-Andra Borca-Tasciuc
Affiliation:
Mechanical and Aerospace Engineering Department, University of California at Los Angeles Los Angeles, CA 90095, U.S.A.
Rajesh Nimbalkar
Affiliation:
Mechanical, Aerospace, and Nuclear Engineering Department, Rensselaer Polytechnic Institute, Troy, NY 12180, U.S.A.
Gang Chen
Affiliation:
Mechanical and Aerospace Engineering Department, University of California at Los Angeles Los Angeles, CA 90095, U.S.A. Mechanical Engineering Department, Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A.
Samuel Graham
Affiliation:
Mechanical Engineering Department, Georgia Institute of Technology, Atlanta, GA 30332, U.S.A.
Theodorian Borca-Tasciuc*
Affiliation:
Mechanical, Aerospace, and Nuclear Engineering Department, Rensselaer Polytechnic Institute, Troy, NY 12180, U.S.A.
*
* Corresponding author. Email address: [email protected].
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Abstract

This work reports temperature dependent thermophysical properties characterization of electrodeposited Ni and NiMn alloys intended for LIGA Microsystems applications. A steady-state method is used to determine the in-plane thermal conductivity. Anisotropic thermal diffusivity characterization is performed using a photothermoelectric technique. The measured thermal properties are dependent on the deposition method and also on subsequent temperature annealing steps. The thermal transport measurement results are correlated with scanning electron microscopy studies of the grain structure and measurements of the electrical transport properties.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 782: Symposium A – Micro- and Nanosystems , 2003 , A6.2
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1. Palumbo, G., Thorpe, S. J. and Aust, K. T., Scripta. Metall. Mater., 24, 1347 (1990).Google Scholar
2. Wolter, S. D., Borca-Tasciuc, D.-A., Chen, G., Govindaraju, N., Collazo, R., Okuzumi, F., Prater, J. T., and Sitar, Z., Diamond and Related Materials, 12, 61 (2003).Google Scholar
3. Borca-Tasciuc, T. and Chen, G., Intl. J. Thermophys., 19, 557 (1998).Google Scholar
4. Borca-Tasciuc, T., Hapenciuc, C. L., Wei, B., Vajtai, R., and Ajayan, P. M., “Anisotropic thermal diffusivity of aligned multiwalled carbon nanotube arrays,” Proc. of the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17–22, 2002, New Orleans, LA, CDROM.Google Scholar
5. Touloukian, Y. S., Powell, R. W., Ho, C. Y., and Klemens, P. G., Thermophysical Properties of Matter, vol. 1, IFI/Plenum, New-York-Washington, (1970).Google Scholar
6. Ashcroft, N. W. and Mermin, N. D., Solid State Physics, Hartcourt College Publishers, Orlando, (1976).Google Scholar
7. Ziman, J. M., Electron and phonons, Oxford Press, (1960).Google Scholar
8. Graham, S., Kelley, J., Yang, N., and Borca-Tasciuc, T., “The Role of Microstructure in the Electrical and Thermal Conductivity of Ni-Alloys for LIGA Microsystems” Journal of Microsystems Technologies, submitted.Google Scholar