Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-23T17:36:29.816Z Has data issue: false hasContentIssue false

Thermoelectric Modules For High Temperature Waste Heat

Published online by Cambridge University Press:  01 February 2011

Ryoji Funahashi
Affiliation:
[email protected], National Institute of Advanced Industrial Science & Technology, 1-8-31 Midorigaoka, Ikeda, Osaka, 563-8577, Japan
Toshiyuki Mihara
Affiliation:
Masashi Mikami
Affiliation:
Saori Urata
Affiliation:
Get access

Abstract

A new adhesive material has been developed in order to obtain practically usable thermoelectric modules composed of oxide thermoelectric legs. The thermoelectric module composed of 8-pair oxide legs has been fabricated. Both hot- and cold-sides of the module were covered by alumina plates. Open circuit voltage VO and maximum power Pmax reach 0.38 V and 0.30 W, respectively at 803 K of a hot-side temperature TH and 362 K of a temperature differential ΔT between TH and cold-side temperature TC. Generating power was repeated 11 times at 873-993 K of TH and at 200-290 K of ΔT. The module was cooled down to room temperature after each generation. At third measurement internal resistance RI of the module increased by 30 %. This is due to destruction of junctions because of thermal strain. No deterioration, however, was observed in thermoelectric properties for the oxide legs.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Terasaki, I., Sasago, Y. and Uchinokura, K., Phys. Rev. B, 56, 12685 (1997).Google Scholar
2. Funahashi, R., Matsubara, I., Ikuta, H., Takeuchi, T., Mizutani, U. and Sodeoka, S., Jpn. J. Appl. Phys., 39, L1127 (2000).Google Scholar
3. Miyazaki, Y., Kudo, K., Akoshima, M., Ono, Y., Koike, Y. and Kajitani, T., Jpn. J. Appl. Phys., 39, L531 (2000).Google Scholar
4. Funahashi, R. and Matsubara, I., Appl. Phys. Lett., 79, 362 (2001).Google Scholar
5. Ohtaki, M., Koga, H., Tokunaga, T., Eguchi, K. and Arai, H., J. Solid State Chem., 120, 105 (1995).Google Scholar
6. Masuda, Y., Ohta, M., Seo, W.S., Pitschke, W. and Koumoto, K., J. Solid State Chem., 150, 221 (2000).Google Scholar
7. Shin, W. and Murayama, N., Jpn. J. Appl. Phys., 38, L1336 (1999).Google Scholar
8. Matsubara, I., Funahashi, R., Takeuchi, T., Sodeoka, S., Shimizu, T., and Ueno, K., Appl. Phys. Lett., 78, 3627 (2001).Google Scholar
9. Shin, W., Murayama, N., Ikeda, K., and Sano, S., J. Power Sources, 103, 80 (2001).Google Scholar
10. Funahashi, R., et al. , to be published.Google Scholar