Hostname: page-component-cd9895bd7-dzt6s Total loading time: 0 Render date: 2024-12-27T02:32:07.704Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermal Wave Inspection in IC Manufacturing

Published online by Cambridge University Press:  25 February 2011

Allan Rosencwaig
Allan Rosencwaig*
Affiliation:
Therma-Wave, Inc., 47734 Westinghouse Dr., Fremont, CA 94539
Get access

Abstract

We describe a highly sensitive, noncontact method for inspecting important, but previously difficult to monitor, processes used in the manufacture of integrated circuits. This technique, based on the detection of thermal waves through laser-induced modulation of the sample's optical reflectance, has proven to be an excellent means for detecting and quantifying the extent of lattice damage or disorder in silicon and gallium arsenide wafers that results from chemopolishing, ion implantation and etching processes. This technique thus provides a powerful and cost effective method for monitoring the quality of incoming wafers, the dose and uniformity of ion implantations and the efficiency and uniformity of dry etch processes. Furthermore this method may be used on actual product wafers as well as test wafers since the measurements are performed in a completely nondamaging fashion and with micronscale resolution.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 69: Symposium D – Materials Characterization , 1986 , 111
Copyright
Copyright © Materials Research Society 1986

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Rosencwaig, A., in VLSI Electronics: Microstructure Science, Vol.9, edited by Einspruch, N.G., (Academic Press, Orlando, 1985), p. 227.Google Scholar
2. Rosencwaig, A., Opsal, J. and Willenborg, D.L., Appl. Phys. Lett. 43, 166 (1983).CrossRefGoogle Scholar
3. Opsal, J., Rosencwaig, A. and Willenborg, D.L., Appl. Optics. 22, 3169 (1983).Google Scholar
4. Rosencwaig, A., Opsal, J., Smith, W.L. and Willenborg, D.L., Appl. Phys. Lett. 46, 1013 (1985).CrossRefGoogle Scholar
5. Opsal, J. and Rosencwaig, A., Appl. Phys. Lett. 47, 498, (1985).Google Scholar
6. Smith, W.L., Rosencwaig, A. and Willenborg, D.L., Appl. Phys. Lett. 47, 584 (1985).Google Scholar
7. Smith, W.L., Rosencwaig, A., Willenborg, D. L., Opsal, J. and Taylor, M.W., Solid State Technology, 29 (1), 85 (1986).Google Scholar
8. Therma-Probe Inspection Systems are products of Therma-Wave, Inc. Fremont, CA 94539.Google Scholar
9. Smith, W.L., Hahn, S. and Arst, M., Fifth International Silicon Symposium, May 4–9, 1986, Boston, MA.Google Scholar
10. Smith, W.L., Powell, R.A. and Woodhouse, J.D., Proc. SPIE 530, 188 (1985).Google Scholar
11. Smith, W.L., Taylor, M.W. and Schuur, J., Proc. SPIE 530, 201 (1985).Google Scholar
12. See references given by Turner, N.L., Current, M., Smith, T.C. and Crane, D. in Solid State Technology, 28, (3), 163 (1985).Google Scholar
13. Fonash, S.J., Solid State Technology, 28, (4), 201 (1985).Google Scholar
14. Borland, J.O. and Drowley, C.I., Solid State Technology, 28, (8), 141 (1985).Google Scholar
15. Garaghty, P. and Smith, W.L., Materials Research Society Spring Meeting, April 15–18, 1986, Palo Alto, CA.Google Scholar