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Thermal Properties Evaluation of Thin Films, Wafers And Substrates

Published online by Cambridge University Press:  25 February 2011

R.P. Tye  and
A. Maesono
R.P. Tye
Affiliation:
Sinku Riko Inc., ULVAC North America Corp, Kennebunk, ME
A. Maesono
Affiliation:
Sinku Riko Inc., Yokohama, Japan
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Abstract

Materials in use or under consideration for many applications in new and emerging technologies are often available only in small quantities and many times in the form of thin films, wafers and sheets. Such size and form limitations present a number of challenges to those wishing to evaluate thermal performance characteristics. This has resulted in a need to develop totally new transient or modify current transient and steady state techniques significantly. Various new or modified techniques to measure thermophysical properties are described. Illustrations of, applications to and results on semiconductors, superconductors, diamonds, polymers, composites and layered structures will be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 169
Copyright
Copyright © Materials Research Society 1991

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References

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