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Thermal, Optical, and Film Properties of a Ladder-like Polysilsesquioxane as Flexible Electronic Device Substrates

Published online by Cambridge University Press:  02 August 2012

Albert S. Lee
Affiliation:
Center for Materials Architecturing, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seong-Buk Gu, Seoul 136-791 Nanomaterials Science and Engineering, University of Science and Technology, 217 Gajungro, 176 Gajung-dong, Yuseong-Gu, Daejeon, Korea 305-333
Seung-Sock Choi
Affiliation:
Center for Materials Architecturing, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seong-Buk Gu, Seoul 136-791
He Seung Lee
Affiliation:
Center for Materials Architecturing, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seong-Buk Gu, Seoul 136-791
Hyeon Yeol Jeon
Affiliation:
Center for Materials Architecturing, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seong-Buk Gu, Seoul 136-791 Nanomaterials Science and Engineering, University of Science and Technology, 217 Gajungro, 176 Gajung-dong, Yuseong-Gu, Daejeon, Korea 305-333
Kyung-Youl Baek
Affiliation:
Center for Materials Architecturing, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seong-Buk Gu, Seoul 136-791 Nanomaterials Science and Engineering, University of Science and Technology, 217 Gajungro, 176 Gajung-dong, Yuseong-Gu, Daejeon, Korea 305-333
Seung Sang Hwang*
Affiliation:
Center for Materials Architecturing, Korea Institute of Science and Technology, Hwarangno 14-gil 5, Seong-Buk Gu, Seoul 136-791 Nanomaterials Science and Engineering, University of Science and Technology, 217 Gajungro, 176 Gajung-dong, Yuseong-Gu, Daejeon, Korea 305-333
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Abstract

A high molecular weight, photocurable inorganic-organic hybrid based on ladder-like poly(phenyl6-co-methacrylate4)silsesquioxanes (LPPMA64) was investigated as a flexible display substrate. Photocured free standing films with 40μm thickness showed high transparency (>95%), excellent thermal stability (Td >450°C), and low coefficient of thermal expansion (38ppm/K) without the use of reinforced glass fibers. Furthermore, these ladder-like structured materials did not require any thermal treatment processes due to the negligible amounts of uncondensed groups, thus simplifying manufacturing processing. These novel hybrid films present an alternative to organic plastics as flexible electronic device substrates due to their excellent optical and thermal properties.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

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References

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