Hostname: page-component-cd9895bd7-q99xh Total loading time: 0 Render date: 2024-12-27T01:54:56.506Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermal Modeling of Plastic Ic Packages

Published online by Cambridge University Press:  26 February 2011

A. Bar-Cohen  and
Devin E. Mix
A. Bar-Cohen
Affiliation:
University of Minnesota, Mechanical Engineering Dept., 111 Church St. S. E., Minneapolis, MN 55455, USA
Devin E. Mix
Affiliation:
University of Minnesota, Mechanical Engineering Dept., 111 Church St. S. E., Minneapolis, MN 55455, USA
Get access

Abstract

The successful design of plastic integrated circuit packages for high performance VLSI chips is a crucial element in the development of costeffective packaging technology. Unfortunately, however, most common plastic encapsulating and die-bonding materials provide relatively low thermal conductivities and large thermal expansion coefficients, as well as low mechanical strengths and a limited operating temperature range. These material properties combine to produce a large number of thermally induced package failure modes. Thus, insightful material selection and detailed design, based on extensive thermal modeling/analysis, must be performed to achieve acceptable levels of component reliability.

This paper begins with a discussion of the temporal development of the temperature fields inside a plastic IC package and continues with the presentation of transient and steady-state, first-order analytical models for: the chip temperature, the temperature and gradient across the die bond, and the half-thickness encapsulant temperature. The values obtained for a typical PDIP package are discussed and compared to the results of a finite-element analysis of this package. The insights obtained from these analyses are used to develop material Figures-of-Merit that can be used in the selection of die-bond and encapsulant materials for plastic IC packages.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 67
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Witzman, S., and Smith, K., and Metelski, G., Silicon Interconnect-A Critical Factor in Device Thermal Management, IEEE Transactions on Components. Hybrids. and Manufacturing Tehnology., Volume 113, Number 4, December 1990.Google Scholar
2. Nishimura, A. and Kawai, S., Effect of Lead Frame Material on Plastic-Encapsulated IC Package Cracking Under Temperature Cycling, 139th Electronic Components Conference, pp. 524–530, 1989.Google Scholar
3.Reliability Prediction of Electronic Equipment, Miitar.y Standardization Handbook, M-HDBK-217.Google Scholar
4. Eckert, E. R. G., and Drake, R. M. Jr, Analysis of Heat and Mass Transfer. Hemisphere Publishing Corporation, p. 169, 1987.Google Scholar
5. Holman, J. P., Heat Transfer. McGraw-Hill Books Compahy, 6th Edition, p. 49, 1986.Google Scholar
6. Shapiro, A. B., Tooaz2D-A Two-Dimensional Finite Element Code for Heat Transfer Analysis. Lawrence Livermore National Laboratory, 1986.Google Scholar
7. Juran, R., Editor, Modern Plastics Encyclopedia 90 McGraw Hill, Inc., 1990.Google Scholar
8. Lewis, C. F., Editor, Materials Engineering Materials Selector I=, Penton Publishing, 1990.Google Scholar
9. Kraus, A. D., and Bar-Cohen, A., Thermal Analysis and Control of Electronic Equipment. Hemisphere Publishing Corporation, pp. 557–558, 1983.Google Scholar
10. Van Kessel, C.G.M., and Gee, S., and Murphy, J., The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking, IEEE Transactions on Components. Hybrids. and Manufacturing Technology, Vol. CHMT–6, Number 4, December, 1983.Google Scholar
11. Edwards, D., and Heinen, K, and Groothuis, S., Shear Stress Evaluation of Plastic Packages, IEEE Transactions on Components. Hybrids, and Manufacturino Technology, Volume CHMT–12, Number 4, December,1987.Google Scholar
12. Thomas, R., Stress-Induced Deformation of Aluminum Metallization in Plastic Molded Semiconductor Devices, IEEE Transactions on Components. Hybrids and Manufacturing Technolvgy. Volume CHMT–8, Number 4, December 1985.Google Scholar
13. Suhir, E., in Advances in Thermal Modeling of Electronic Components and Systems, edited by Bar-Cohen, A., and Kraus, A., (Hemisphere Publishing Corporation, 1988, Volume 1), pp. 337–412.Google Scholar
14. Ewalds, H., and Wanhill, R., Fracture Mechanics, Edward Arnold and Delftse Uitgevers Maatschappij (Publishers), 1985.Google Scholar