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Thermal conductivity study of porous low K dielectric materials

Published online by Cambridge University Press:  10 February 2011

Chuan Hu ,
Michael Morgen ,
Paul S. Ho ,
Anurag Jain ,
William. N. Gill ,
Joel L. Plawsky  and
Peter C. Wayner Jr.
Chuan Hu
Affiliation:
Institute for Materials Science, Univ. of Texas, Austin, TX 78712
Michael Morgen
Affiliation:
Institute for Materials Science, Univ. of Texas, Austin, TX 78712
Paul S. Ho
Affiliation:
Institute for Materials Science, Univ. of Texas, Austin, TX 78712
Anurag Jain
Affiliation:
Dept. of Chemical Engineering, Rensselaer Poly. Inst. Troy, NY 12180
William. N. Gill
Affiliation:
Dept. of Chemical Engineering, Rensselaer Poly. Inst. Troy, NY 12180
Joel L. Plawsky
Affiliation:
Dept. of Chemical Engineering, Rensselaer Poly. Inst. Troy, NY 12180
Peter C. Wayner Jr.
Affiliation:
Dept. of Chemical Engineering, Rensselaer Poly. Inst. Troy, NY 12180
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Abstract

A quantitative characterization of the thermal properties is required to assess the thermal performance of low dielectric constant materials. Recently we have developed a technique based on the 3-omega method for measuring the thermal conductivity of porous dielectric thin films. In this paper we present the results on the measurements of thermal conductivity of thin porous films using this method. A finite element method analysis is used to evaluate the approximations used in the measurement. Two porosity-weighted thermal resistor models are proposed to interpret the results. By studying the dependence of the thermal conductivity on porosity, we are able to discuss the scaling rule of thermal conductivity. Additionally, a steady state layered heater model is used for evaluating the significance of introducing porous ILDs into an interconnect structure.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 565: Symposium O – Low-Dielectric Constant Materials V , 1999 , 87
Copyright
Copyright © Materials Research Society 1999

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