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Thermal Conductivity of Carbon Nanotube CompositeFilms

Published online by Cambridge University Press:  17 March 2011

Quoc Ngo ,
Brett A. Cruden ,
Alan M. Cassell ,
Megan D. Walker ,
Qi Ye ,
Jessica E. Koehne ,
M. Meyyappan ,
Jun Li  and
Cary Y. Yang
Quoc Ngo
Affiliation:
Center for Nanostructures, Santa Clara University, 500 El Camino Real Santa Clara, CA 95050, USA Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Brett A. Cruden
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Alan M. Cassell
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Megan D. Walker
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Qi Ye
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Jessica E. Koehne
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
M. Meyyappan
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Jun Li
Affiliation:
Center for Nanotechnology, NASA Ames Research Center Moffett Field, CA, 94035, USA
Cary Y. Yang
Affiliation:
Center for Nanostructures, Santa Clara University, 500 El Camino Real Santa Clara, CA 95050, USA
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Abstract

State-of-the-art ICs for microprocessors routinely dissipate power densitieson the order of 50 W/cm2. This large power is due to thelocalized heating of ICs operating at high frequencies, and must be managedfor future high-frequency microelectronic applications. Our approachinvolves finding new and efficient thermally conductive materials.Exploiting carbon nanotube (CNT) films and composites for their superioraxial thermal conductance properties has the potential for such anapplication requiring efficient heat transfer. In this work, we presentthermal contact resistance measurement results for CNT and CNT-Cu compositefilms. It is shown that Cu-filled CNT arrays enhance thermal conductancewhen compared to as-grown CNT arrays. Furthermore, the CNT-Cu compositematerial provides a mechanically robust alternative to current IC packagingtechnology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F3.18
Copyright
Copyright © Materials Research Society 2004

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