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Thermal Conductivity and Heat Transfer in Superlattices

Published online by Cambridge University Press:  15 February 2011

G. Chen
Affiliation:
Department of Mechanical Engineering and Materials Science Duke University, Durham, NC27708, [email protected]
M. Neagu
Affiliation:
Department of Mechanical Engineering and Materials Science Duke University, Durham, NC27708, [email protected]
T. Borca-Tasciuc
Affiliation:
Department of Mechanical Engineering and Materials Science Duke University, Durham, NC27708, [email protected]
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Abstract

Understanding the thermal conductivity and heat transfer processes in superlattice structures is critical for the development of thermoelectric materials and devices based on quantum structures. This work reports progress on the modeling of thermal conductivity of superlattice structures. Results from the models established based on the Boltzmann transport equation could explain existing experimental results on the thermal conductivity of semiconductor superlattices in both in plane and cross-plane directions. These results suggest the possibility of engineering the interfaces to further reduce thermal conductivity of superlattice structures.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

[1] Hicks, L.D., and Dresselhaus, M.S., Phy. Rev. B, 47, p. 1272712731 (1993).Google Scholar
[2] Yao, T., Appl. Phys. Lett., 51, p. 17981800 (1987).Google Scholar
[3] Chen, G., Tien, C.L., Wu, X., and Smith, J.S., J. Heat Transf. 116, p. 325331 (1994).Google Scholar
[4] Yu, X.Y., Chen, G., Verma, A., and Smith, J.S., Appl. Phys. Lett., 67, p. 35533556 (1995).Google Scholar
[5] Capsinski, W.S. and Maris, H.J., Physica B, 219&220, p. 699701 (1996).Google Scholar
[6] Lee, S.-M., Cahill, D., and Venkatasubramanian, R., private communication (1997).Google Scholar
[7] Venkatasubramanian, R., Naval Research News, XLVIII, 3143 (1996).Google Scholar
[8] Ren, S.Y. and Dow, J.D., Phys. Rev. B, 25, p. 37503755 (1982).Google Scholar
[9] Callaway, J., Phys. Rev., 113, p. 10461051 (1959).Google Scholar
[10] Chen, G., in ASME Proc. 31st National Heat Transf. Conf., HTD-323, p. 121129 (1996), more details to appear in J. Heat Transf..Google Scholar
[11] Chen, G., in Micro-Electro-Mechanical-Systems (Proc. ASME Int. Mech. Eng. Congress), DSC-59, p. 1324 (1996).Google Scholar
[12] Hyldgaard, P. and Mahan, G.D., in Thermal Conductivity 23, edited by Wilkes, K.E., Dinwiddie, R.B., and Graves, R.S. Technomic Publishing Co., Inc., 1996, p. 172182.Google Scholar
[13] Majumdar, A., J. Heat Transf., 115, p. 716 (1993).Google Scholar
[14] Chen, G. and Tien, C.L., J. Thermophys. Heat Transf., 7, p. 311318 (1993).Google Scholar
[15] Little, W.A., Can. J. Phys., 37, p. 334349 (1959).Google Scholar
[16] Holland, M.G., Phys. Rev., A, 134, p. 471480 (1964).Google Scholar
[17] Curruthers, P., Rev. Mod. Phys., 33, p. 92138 (1961).Google Scholar
[18] Swartz, E.T. and Pohl, R.O., Rev. Mod. Phys., 61, p. 605668 (1989).Google Scholar
[19] Bode, M.H. and Ourmazd, A., J. Vac. Sci. Techn., B, 10, p. 17871792 (1992).Google Scholar
[20] LeGoues, F.K., Meyerson, B.S., Morar, J.F., and Kirehner, P.D., J. Appl. Phys., 71, p. 42304243 (1992).Google Scholar
[21] Zheng, X.Y., Li, S.Z., Chen, M., and Wang, K.L., in Micro-Electro-Mechanical-Systems (Proc. ASME Int. Mech. Eng. Congress), DSC-59, p. 9398 (1996).Google Scholar