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Thermal And Mechanical Properties Of Low K Polymers

Published online by Cambridge University Press:  15 February 2011

Chien Chiang ,
Anne S. Mack ,
Chuanbin Pan ,
Yui-Lin Ling  and
David B. Fraser
Chien Chiang
Affiliation:
Intel Corp., Components Research, Santa Clara, CA
Anne S. Mack
Affiliation:
Intel Corp., Components Research, Santa Clara, CA
Chuanbin Pan
Affiliation:
Intel Corp., Components Research, Santa Clara, CA
Yui-Lin Ling
Affiliation:
Intel Corp., Components Research, Santa Clara, CA
David B. Fraser
Affiliation:
Intel Corp., Components Research, Santa Clara, CA
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Abstract

Low dielectric constant polymers offer many advantages in circuit performance, such as power dissipation, crosstalk and RC delay, when used as inter-layer dielectrics (ILDs). Silicon dioxide, a material commonly used as an ILD has a dielectric constant of 4.0. Organic polymers that have dielectric constant values ranging from 2.0 to 3.0 offer attractive alternatives to SiO2. However, it has been a great challenge to find organic polymers with thermal stability up to 450 °C. We have characterized thermal properties of polymers using thermal desorption analysis. isothermal TGA and FTIR to identify weak functional groups. In addition, we have measured the hardnesses and moduli of these polymers and found that the values are much lower than those of SiO2.Stress distributions in the interconnect system were analyzed using finite element modeling in order to understand potential reliability problems.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 381: Symposium F – Low-Dielectric Constant Materials--Synthesis and Applications in Micro. , 1995 , 123
Copyright
Copyright © Materials Research Society 1995

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References

1 Zhang, X., You, L., Dabral, S., Chiang, C., Yaney, D.S., Joshi, R.V., Yang, G.R., Lu, T.M. and McDonald, J.F., ”Planarizing Techniques for Parylene as an Interlayer Dielectric”, Proc. VMIV, P. 168–174, 1993 Google Scholar
2. Chiang, C., Richards, C., Vu, Q., Mack, A.S., Fraser, D. B., Yokotsuka, T. and Nakamura, M., ”The Use of CPFP, a New Fluoropolymer as an Interlayer dielectric for ULSI Application”, Extended Abstract #294, ECS spring meeting, 1993 Google Scholar
3. Flinn, P.A., Gardner, D. S., and Nix, W.D., IEEE Trans. Electron Devices ED-34, 689, 1987 Google Scholar
4.Brian Auman, “Fluorinated Polyimides with Low dielectric Constant, Low Moisture Absorption, and Low Coefficient of Thermal Expansion for Use as Interlayer Dielectrics”, DUMIC Proceedings, P.297-P.304, 1995 Google Scholar
5. Hrubesh, L.W., Poco, J. F.,”Aerogel films for Optical, thermal, Acoustic and Electronic Applications”, abstract 11.5, 4th International Symposium on Aerogels, Berkeley, 1994 Google Scholar
6. Hendricks, N., Wan, B. and Smith, A., ” Fluorinated Poly(arylethers): Low Dielectric Constant, Thermally Stable Polymers for Sub-half Micron IMD Applications”, DUMIC Proceedings, P. 283–289, 1995 Google Scholar
7. ANSYS finite element program, Swanson Analysis Systems, 1992.Google Scholar