Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-25T17:52:07.106Z Has data issue: false hasContentIssue false

Texture Formation and Improvement of Grain Boundary Weak‐Links in Tape Shaped Wire Prepared by the Unidirectional Solidification Technique.

Published online by Cambridge University Press:  28 February 2011

Michiya Okada
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Toyotaka Yuasa
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Tosimi Matsumoto
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Katuzo Aihara
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Masahiro Seido
Affiliation:
Metal Research Laboratory, Hitachi Cable Ltd., Tsuchiura, Ibaraki 300.
Sinpei Matsuda.
Affiliation:
Hitachi Research Laboratory, Hitachi Ltd., Hitachi, Ibaraki 319‐12.
Get access

Abstract

Au‐Sheathed Y‐Ba‐Cu‐O(YBCO) and Tl‐Ba/Sr‐Ca‐Cu‐O(TBSCCO) tapes were fabricated by the drawing‐rolling and subsequent unidirectional solidification. A typical microstructure of melt‐textured polycrystallite including fine particles of second phase(e.q. Y‐211) was observed. The Tl‐2223 tapes prepared at an optimized condition yielded Jc=15,300 A/cm2 at 77K in the absence of magnetic field, and l,100A/cm2 in a magnetic field of IT. The enhancement of Jc in a magnetic field is suggested to be due to the improvement of weak‐links in grain boundaries.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Matsuda, S., Okada, M., Morimoto, T., Matsumoto, T. and Aihara:, K. High‐Temperature Superconductors, ed. Brodsky, M. B., Dynes, R. C., Kitazawa, K. and Tuller, H. L. (MRS, Pittsburgh, 1988)p695.Google Scholar
2 Okada, M., Okayama, A., Morimoto, T., Matsumoto, T., Aihara, K. and Matsuda:, S. Jpn. J. AppL Phys. 27(1988)L185.Google Scholar
3 Matsumoto, T., Okada, M., Okayama, A., Morimoto, T., Aihara, K., and Matsuda:, S. World Congress on Superconductivity, ed. Burnham, C. G. and Kane, R.(World Scientific Pub., Singapole, 1988) p321.Google Scholar
4 Okada, M., Nishiwaki, R., Kamo, T., Matsumoto, T., Aihara, K., Matsuda, S., and Seido:, M. Jpn. J. AppL Phys. 27(1988)L2345.Google Scholar
5 Matsumoto, T., Okada, M., Nishiwaki, R., Kamo, T., Aihara, K., Matsuda, S., Seido, M., Ozawa, K., Morii, Y. and Funahashi:, S. ISTEC WORKSHOP ON SUPERCONDUCTIVITY. Oiso. Feb. 13. 1989. (ISTEC, 1989) pill.Google Scholar
6 Yamada, Y., Fukushima, N., Nakayama, S., Yoshino, H. and Murase:, S. Jpn. J. AppL Phys. 26(1987)L865.Google Scholar
7 Jin, S., Sherwood, R. C., Van Dover, R. B., Tiefel, T. H. and Jornson, D. W. Jr: AppL Phys. Lett. 51(1987)203.Google Scholar
8 Murakami, M., Matsuda, S., Sawano, K., Miyamoto, K., Hayasi, A., Morita, M., Doi, K., Teshima, H., Sugiyama, M., Kimura, M., Fujinami, M., Saga, M., Matsuo, M., and Hamada:, H. Advances in Superconductivity. (Springer‐Verlag, 1988), p247.Google Scholar
9 Chaudhari, P., Mannhart, J., Dimos, D., Tsuei, C. C., Chi, J., Oprysko, M. M. and Scheuermann:, M. Phys. Rev. Lett. 60(1988)1653.Google Scholar
10 Dimos, D., Chaudhari, P., Manhart, J. and LeGoues:, F. K. Phys. Rev. Lett. 61(1988)219.Google Scholar
11 Bean:, C. P. Phys. Rev. Lett. 8(1962)250.Google Scholar
12 Soeta, A., Suzuki, T., Takeuchi, S., Kamo, T., Matsuda:, S. Proc. 2nd INTERNATIONAL CONFERENCE ON SUPERCONDUCTIVITY. (ISTEC, 1989) (to be published)Google Scholar