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A Tem Investigation of the Effects of Tensile Stress on Thin Film Microstructure and Surface Morphology

Published online by Cambridge University Press:  21 February 2011

Karen E. Harris  and
Alexander H. King
Karen E. Harris
Affiliation:
Department of Materials Science & Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794-2275.
Alexander H. King
Affiliation:
Department of Materials Science & Engineering, State University of New York at Stony Brook, Stony Brook, NY 11794-2275.
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Abstract

We have studied the microscopic effects of tensile stress on film thickness and grain growth in gold thin films of 25nm nominal thickness using transmission electron microscopy. Free-standing films were annealed at 150°C resulting in films with columnar grains and 〈111〉 fiber texture. After repeated anneals, tensile stresses caused by grain growth became large enough to cause cracks to form and propagate diffusively. While tensile stress must eventually result in an overall decrease in film thickness, local specimen thickening in front of crack tips is observed. The tensile stress also profoundly affected grain growth in these films. Grains near crack tips are larger than grains 400nm away from the tips, and elongated grains with axial ratios greater than 15 have been observed in cracked regions of the films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 75
Copyright
Copyright © Materials Research Society 1995

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