Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2024-12-27T01:38:15.943Z Has data issue: false hasContentIssue false

Synthesis of Ultra-thin stacked oxides using low pressure single furnace cluster process

Published online by Cambridge University Press:  10 February 2011

P. K. Roy
Affiliation:
Bell Laboratories, Lucent Technologies, Orlando, FL 32819
D. Brady
Affiliation:
Bell Laboratories, Lucent Technologies, Orlando, FL 32819
S. Chetlur
Affiliation:
Bell Laboratories, Lucent Technologies, Orlando, FL 32819
Y. Ma
Affiliation:
Bell Laboratories, Lucent Technologies, Orlando, FL 32819
K. Morse
Affiliation:
Bell Laboratories, Lucent Technologies, Orlando, FL 32819
Get access

Abstract

This work describes the development of a new grow-deposit-grow cluster process to grow ultra-thin stacked oxides. Two approaches for stacked oxide synthesis are discussed, namely thermal and chemical stacked oxides. Fabrication of chemical stacked oxide involves forming the first grown layer chemically after pre-gate cleaning, subsequent deposition of a TEOS-SiO2 layer and final densification/oxidation in a single low pressure (LP) furnace operation. In comparison, all three steps for thermal stacked oxide are accomplished by the LP cluster operation. Both processes offer the advantages of reduced cycle time and higher throughput to the stacked gate technology that produces superior Si/SiO2 interfaces and exhibits higher resistance to plasma-damage during ultra large scale integrated circuit (ULSI) processing. The quality and electrical characteristics of the stacked oxides are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Roy, P.K. and Sinha, A.K., AT&T Tech. J., 67 (6), 155 (1988).Google Scholar
2. Tseng, H.-H, Tobin, P.J., Hayden, J.D. and Chang, K. -M., IEDM Tech Dig. 421 (1992).Google Scholar
3. Kern, W.., Handbook of Semicond. Wafer cleaning Technology, Noyes, 1993.Google Scholar
4. Quantox oxide Monitoring System Manual, Keithley.Google Scholar
5. Cochran, W.T., Semiconductor International, 146 (May, 1991).Google Scholar
6. Roy, P.K., Ma, Y. and Weinhoffer, M., J. Vac. Sci. Technol. A, 14 (3), 967 (1996).Google Scholar