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Synthesis of Resistive Memory Oxides by Ion Implantation

Published online by Cambridge University Press:  21 May 2012

S.M. Bishop
Affiliation:
University at Albany, SUNY, College of Nanoscale Science and Engineering, Albany, NY 12203, U.S.A
Z.P. Rice
Affiliation:
University at Albany, SUNY, College of Nanoscale Science and Engineering, Albany, NY 12203, U.S.A
B.D. Briggs
Affiliation:
University at Albany, SUNY, College of Nanoscale Science and Engineering, Albany, NY 12203, U.S.A
H. Bakhru
Affiliation:
University at Albany, SUNY, College of Nanoscale Science and Engineering, Albany, NY 12203, U.S.A
N.C. Cady
Affiliation:
University at Albany, SUNY, College of Nanoscale Science and Engineering, Albany, NY 12203, U.S.A
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Abstract

In this work, we report on the use ion of implantation to synthesize resistive memory oxides. The surface of copper thin films was converted to copper oxide using oxygen implantation. Devices fabricated from the copper oxide (CuxO) layers exhibited unipolar switching behavior without the need for a forming voltage. Technology scaling was demonstrated by oxygen implanting copper damascene vias. Unipolar switching was observed in via-based devices down to 48 nm. The current-voltage data of devices scaled from 100 μm to 48 nm suggests that the RESET transition is related to localized Joule heating. Tantalum oxide (TaxOy) was also created by oxygen implantation but exhibited bipolar resistive switching. Analysis of the conduction suggests that the difference between the two resistance states in these devices is largely due to a lowering of the Pt-TaxOy Schottky barrier.

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Articles
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

[1] Bishop, S.M. et al. ., Mater. Res. Soc. Symp. 1337, 55 (2011).Google Scholar
[2] Briggs, B.D. et al. ., Mater. Res. Soc. Symp. 1337, 49 (2011).Google Scholar
[3] Bishop, S.M. et al. ., Mater. Res. Soc. Symp. 1337, 91 (2011).Google Scholar
[4] Waser, R., Dittmann, R., Staikov, G., and Szot, K., Adv. Mater. 21, 2632 (2009).Google Scholar
[5] Bishop, S. M., Bakhru, H., Capulong, J.O., and Cady, N.C., Appl. Phys. Lett. 100, 142111 (2012).Google Scholar
[6] Bishop, S.M. et al. ., Appl. Phys. Lett. 99, 202102 (2011).Google Scholar
[7] Mageea, C.W. et al. ., Appl. Surf. Sci. 255, 805 (2008).Google Scholar
[8] Rakhshani, A.E., Solid State Electron. 29, 7 (1986).Google Scholar
[9] Campell, S.A. (2001). The Science and Engineering of Microelectronic Fabrication, Second Edition. New York: Oxford University Press.Google Scholar
[10] Russo, U., Ielmini, D., Cagli, C., and Lacaita, A.L., IEEE Transactions on Device Lett. 56, 193 (2009).Google Scholar
[11] Ezhilvalavan, S. and Tseng, T.-Y., J. Appl. Phys. 83, 4797 (1998).Google Scholar
[12] Blonkowski, S., Regache, M., and Halimaoui, A., J. Appl. Phys. 90, 1501 (2001).Google Scholar
[13] Fleming, R.M. et al. ., J. Appl. Phys. 88, 850(2000).Google Scholar
[14] Robertson, J., J. Vac. Sci. Technol. B, 18, 1787 (2000).Google Scholar
[15] Miao, F. et al. ., ACS Nano. 6, 2312 (2012).Google Scholar
[16] Wei, Z. et al. ., Tech. Dig. Int. Electron Devices Meeting, San Francisco, CA, 2008, pp. 1-4.Google Scholar