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Synthesis and Characterization of Nanocomposite Thin Films for MEMS Applications

Published online by Cambridge University Press:  31 January 2011

Kaushik Das ,
Cheol Park ,
Rosemary Le Faive ,
Pascal Hubert  and
Srikar Vengallatore
Kaushik Das
Affiliation:
[email protected], McGill University, Mechanical Engineering, Montreal, Canada
Cheol Park
Affiliation:
[email protected], National Institute of Aerospace, Hampton, Virginia, United States
Rosemary Le Faive
Affiliation:
[email protected], McGill University, Mechanical Engineering, Montreal, Canada
Pascal Hubert
Affiliation:
[email protected], McGill University, Mechanical Engineering, Montreal, Canada
Srikar Vengallatore
Affiliation:
[email protected], McGill University, Mechanical Engineering, Montreal, Canada
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Abstract

Reinforcement with nanotubes, nanofibers, and nanoparticles is an attractive option for enhancing the properties of micromachined polymeric structures employed in microelectromechanical systems (MEMS). Calculations based on Eshelby-Mori-Tanaka micromechanics predict that the elastic modulus and wave velocity can be increased by over an order of magnitude by reinforcing polymers with aligned, dispersed, single-walled carbon nanotubes (SWNT). Motivated by this prediction, we measured the elastic moduli of polyimide films reinforced with SWNT at volume fractions ranging from 0 to 10%. For dilute composites, the elastic modulus increased with increasing nanotube loading from 2.5 GPa for the neat polymer to 3.5 GPa for a nanocomposite containing 0.5 vol% of SWNT. However, with further increase in the nanotube content, the elastic modulus remained essentially constant even for high loadings of 10 vol% of SWNT. In addition, significantly different elastic moduli were measured for specimens containing the same volume fraction (0.5 vol%) of SWNT produced by two different processes.

Keywords

nanoscalecompositeelastic properties
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1222: Symposium DD – Microelectromechanical Systems — Materials and Devices III , 2009 , 1222-DD05-06
Copyright
Copyright © Materials Research Society 2010

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