Hostname: page-component-586b7cd67f-l7hp2 Total loading time: 0 Render date: 2024-11-25T15:29:57.243Z Has data issue: false hasContentIssue false

Surface Roughness of Silicon-Nitride Gate Insulators Deposited in a 40-MHZ Glow Discharge

Published online by Cambridge University Press:  10 February 2011

H. Meiling
Affiliation:
Debye Institute, Utrecht University, P.O. Box 80.000, NL-3508 TA Utrecht, the Netherlands.
E. Ten Grotenhuis
Affiliation:
Debye Institute, Utrecht University, P.O. Box 80.000, NL-3508 TA Utrecht, the Netherlands.
W. F. Van Der Weg
Affiliation:
Debye Institute, Utrecht University, P.O. Box 80.000, NL-3508 TA Utrecht, the Netherlands.
J. J. Hautala
Affiliation:
Tokyo Electron America, Inc., 123 Brimbal Avenue, Beverly MA 01915, USA.
J. F. M. Westendorp
Affiliation:
Tokyo Electron America, Inc., 123 Brimbal Avenue, Beverly MA 01915, USA.
Get access

Abstract

The surface morphology of 40-MHz PECVD SiNx films is investigated. We report on the correlation between the deposition conditions, bulk properties, and surface roughness of these TFT insulators. The roughness is measured with atomic-force microscopy, AFM. A link will be presented between the AFM properties and the effects of hydrogen dilution during deposition: gas composition and rf-power-density (P) dependences will be discussed. An increase of the surface roughness to 3.7 nm is observed upon H2 dilution and P increase, ascribed to enhanced ion bombardment of the surface during growth.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Claassen, W. A. P., Valkenburg, W. G. J. N., Willemsen, M. F. C., and Wijgert, W. M. v. d., J. Electrochem. Soc. 132 (4), 893 (1985).Google Scholar
[2] Smith, D. L., Alimonda, A. S., Chen, C. C., Ready, S. E., and Wacker, B., J. Electrochem. Soc. 137 (2), 614 (1990).Google Scholar
[3] Smith, D. L., J. Vac. Sci. Technol. A 11 (4), 1843 (1993).Google Scholar
[4] Cotler, T. J. and Chapple-Sokol, J., J. Electrochem. Soc. 140 (7), 2071 (1993).Google Scholar
[5] Parsons, G. N., Souk, J. H., and Batey, J., J. Appl. Phys. 70 (3), 1553 (1991).Google Scholar
[6] Loboda, M. J. and Seifferly, J. A., J. Mater. Res. 11 (2), 391 (1996).Google Scholar
[7] Kuo, Y., J. Electrochem. Soc. 142 (7), 2486 (1995).Google Scholar
[8] Habraken, F. H. P. M. and Kuiper, A. E. T., Mat. Sci. Engineer. R12 (3), 123 (1994).Google Scholar
[9] Shirai, H., Jpn. J. Appl. Phys. 34 (2A), 450 (1995).Google Scholar
[10] Abelson, J. R., Appl. Phys. A 56, 493 (1993).Google Scholar
[11] Uchida, H., Takechi, K., Nishida, S., and Kaneko, S., Jpn. J. Appl. Phys. 30 (12B), 3691 (1991).Google Scholar
[12] Meiling, H., Westendorp, J. F. M., Hautala, J. J., Salch, Z. M., and Malone, C. T., in Flat Panel Display Materials, edited by Batey, J., Chiang, A., and Holloway, P. H. (Mater. Res. Soc. Proc. 345, Pittsburgh, PA, 1994), p. 65.Google Scholar
[13] Westendorp, J. F. M., Meiling, H., Pollock, J. D., Berrian, D. W., Laflamme, A. H. Jr., Hautala, J. J., and Vanderpot, J., in Flat Panel Display Materials, edited by Batey, J., Chiang, A., and Holloway, P. H. (Mater. Res. Soc. Proc. 345, Pittsburgh, PA, 1994), p. 175.Google Scholar
[14] Sherman, S., Lu, P.-Y., Gottscho, R. A., and Wagner, S., in Amorphous Silicon Technology – 1995, edited by Hack, M., Schiff, E. A., Madan, A., Powell, M., and Matsuda, A. (Mater. Res. Soc. Proc. 377, Pittsburgh, PA, 1995), p. 749.Google Scholar
[15] Lanford, W. A. and Rand, M. J., J. Appl. Phys. 49 (4), 2473 (1978).Google Scholar
[16] Campmany, J., Bertran, E., Andújar, J. L., Canillas, A., López-Villegas, J. M., and Morante, J. R., in Amorphous Silicon Technology – 1992, edited by Thompson, M. J., Hamakawa, Y., LeComber, P. G., Madan, A., and Schiff, E. A. (Mater. Res. Soc. Proc. 258, Pittsburgh, PA, 1992), p. 643.Google Scholar
[17] Kobayashi, I., Ogawa, T., and Hotta, S., Jpn. J. Appl. Phys. 31, 336 (1992).Google Scholar