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Surface Imaging of III–V Semiconductors by Reflection Electron Microscopy and Inner Potential Measurements
Published online by Cambridge University Press: 15 February 2011
Abstract
Surfaces of two III–V semiconductor materials have been examined at 120 kV by reflection electron microscopy (REM) at high spatial resolution. Surface steps were found to give characteristic contrast due to several diffraction effects, one of which is interference between the Bragg (B) and Bragg–Laue (BL) reflected beam at a step edge. The electron diffraction pattern from a step showed split lines from B and BL reflections, which provides a method of accurately measuring the mean inner potential of these materials. Electron energy loss spectra showed large surface and bulk plasmon peaks which mainly limit the spatial resolution of REM. The penetration depth in REM is given.
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