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Suitability of 4H-SiC Homoepitaxy for the Production and Development of Power Devices

Published online by Cambridge University Press:  01 February 2011

Christian Hecht
Affiliation:
[email protected], SiCED Electronics Development GmbH & Co. KG, Guenther-Scharowsky-Strasse 1, Erlangen, 91058, Germany, +49 9131 734336, +49 9131 723046
Bernd Thomas
Affiliation:
[email protected], SiCED Electronics Development GmbH & Co. KG, Guenther-Scharowsky-Strasse 1, D-91058 Erlangen, Germany
Rene Stein
Affiliation:
[email protected], SiCED Electronics Development GmbH & Co. KG, Guenther-Scharowsky-Strasse 1, D-91058 Erlangen, Germany
Peter Friedrichs
Affiliation:
[email protected], SiCED Electronics Development GmbH & Co. KG, Guenther-Scharowsky-Strasse 1, D-91058 Erlangen, Germany
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Abstract

In this paper, we present results of epitaxial layer deposition for production needs using our hot-wall CVD multi-wafer system VP2000HW from Epigress with a capability of processing 6×100mm wafers per run. Intra-wafer and wafer-to-wafer homogeneities of doping and thickness for full-loaded 6×100mm runs will be shown and compared to results of the former 7×3″ setup. The characteristic of the run-to-run reproducibility for the 6×100mm setup will be discussed. To demonstrate the suitability of the reactor for device production results on Schottky Barrier Diodes (SBD) processed in the multi-wafer system will be given. Furthermore, we show results for n- and p-type SiC homoepitaxial growth on 3″, 4° off-oriented substrates using a single-wafer hot-wall reactor VP508GFR from Epigress for the development of PiN-diodes with blocking voltages above 6.5 kV. Characteristics of n- and p-type epilayers and doping memory effects are discussed. 6.5 kV PiN-diodes were fabricated and electrically characterized. Results on reverse blocking behaviour, forward characteristics and drift stability will be presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

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